Inventor · disambiguated record

Susan A. Oliver

Also filed as: OLIVER SUSAN A

1 granted patent·27 citations·filing 1994–1994

43Inventor score

Technology areasH10W

Files withLSI LOGIC CORP1

Top patents by PatentIndex Score

1 record

0153US5504374AMicrocircuit package assembly utilizing large size die and low temperature curing organic die attach materialLSI LOGIC CORP·Filed 1994·Granted Apr 2, 1996·27 cites·19 claims

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