Inventor

TAKAHASHI TOMOKAZU

JP14 patents

⚠️ This page may combine multiple inventors who share the name “TAKAHASHI TOMOKAZU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KOMATSU MFG CO LTD

2 patents

US5450436ASep 12, 1995

Laser gas replenishing apparatus and method in excimer laser system

KOMATSU MFG CO LTD123 citations97

US6418155B1Jul 9, 2002

Laser device

KOMATSU MFG CO LTD10 citations73

NITTO DENKO CORP

2 patents

US7514143B2Apr 7, 2009

Re-peelable pressure-sensitive adhesive sheet

NITTO DENKO CORP17 citations83

US7586060B2Sep 8, 2009

Protective sheet for laser processing and manufacturing method of laser processed parts

NITTO DENKO CORP13 citations82

HABU TAKASHI

2 patents

US8546958B2Oct 1, 2013

Pressure-sensitive adhesive sheet for protecting semiconductor wafer

HABU TAKASHI0 citations43

US8388786B2Mar 5, 2013

Substrate-less pressure-sensitive adhesive sheet for protection of semiconductor wafer, method for grinding back side of semiconductor wafer using pressure-sensitive adhesive sheet, and method for producing pressure-sensitive adhesive sheet

HABU TAKASHI0 citations33

MAEKAWA MASANORI

1 patent

US8727757B2May 20, 2014

Molding die set and resin molding apparatus having the same

MAEKAWA MASANORI8 citations78

TAKAHASHI TOMOKAZU

1 patent

US8603630B2Dec 10, 2013

Radiation-curable adhesive composition and adhesive sheet

TAKAHASHI TOMOKAZU7 citations78

TDK CORP

1 patent

US4569550AFeb 11, 1986

Apparatus for automatically mounting electronic circuit element on printed circuit board

TDK CORP14 citations73

TAKAMOTO NAOHIDE

1 patent

US8643194B2Feb 4, 2014

Dicing tape-integrated film for semiconductor back surface

TAKAMOTO NAOHIDE4 citations72

AOYAGI SEIJI

1 patent

US9413272B2Aug 9, 2016

Power generation device having a dielectric body and an electret

AOYAGI SEIJI4 citations70

TOYOTA MOTOR CO LTD

1 patent

US7242992B2Jul 10, 2007

Parts supply system problem detection support system and method, and program for the same

TOYOTA MOTOR CO LTD4 citations54

THE SCHOOL CORPORATION KANSAI UNIV

1 patent

US12161354B2Dec 10, 2024

Adhering body and adhesion device

THE SCHOOL CORPORATION KANSAI UNIV0 citations50

URAIRI MASAKATSU

1 patent

US8778118B2Jul 15, 2014

Manufacturing method of laser processed parts, and pressure-sensitive adhesive sheet for laser processing used for the same

URAIRI MASAKATSU1 citations44