Inventor

TOWNSEND III PAUL H

US16 patents

⚠️ This page may combine multiple inventors who share the name “TOWNSEND III PAUL H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DOW GLOBAL TECHNOLOGIES INC

10 patents

US6630520B1Oct 7, 2003

Composition containing a cross-linkable matrix precursor and a poragen, and a porous matrix prepared therefrom

DOW GLOBAL TECHNOLOGIES INC93 citations98

US6653358B2Nov 25, 2003

Composition containing a cross-linkable matrix precursor and a poragen, and a porous matrix prepared therefrom

DOW GLOBAL TECHNOLOGIES INC41 citations95

US7109249B2Sep 19, 2006

Composition containing a cross-linkable matrix precursor and a poragen, and porous matrix prepared therefrom

DOW GLOBAL TECHNOLOGIES INC28 citations92

US6946382B2Sep 20, 2005

Process for making air gap containing semiconducting devices and resulting semiconducting device

DOW GLOBAL TECHNOLOGIES INC20 citations92

US6646081B2Nov 11, 2003

Polyarylene compositions with enhanced modulus profiles

DOW GLOBAL TECHNOLOGIES INC29 citations92

US7115531B2Oct 3, 2006

Organosilicate resins as hardmasks for organic polymer dielectrics in fabrication of microelectronic devices

DOW GLOBAL TECHNOLOGIES INC35 citations90

US6815333B2Nov 9, 2004

Tri-layer masking architecture for patterning dual damascene interconnects

DOW GLOBAL TECHNOLOGIES INC34 citations89

US6887910B2May 3, 2005

Composition containing a cross-linkable matrix precursor and a poragen, and a porous matrix prepared therefrom

DOW GLOBAL TECHNOLOGIES INC7 citations73

US6790792B2Sep 14, 2004

Low dielectric constant polymers having good adhesion and toughness and articles made with such polymers

DOW GLOBAL TECHNOLOGIES INC9 citations73

US7268200B2Sep 11, 2007

Organosilicate resins as hardmasks for organic polymer dielectrics in fabrication of microelectronic devices

DOW GLOBAL TECHNOLOGIES INC8 citations70

DOW CHEMICAL CO

6 patents

US5965679AOct 12, 1999

Polyphenylene oligomers and polymers

DOW CHEMICAL CO229 citations98

US6359091B1Mar 19, 2002

Polyarylene compositions with enhanced modulus profiles

DOW CHEMICAL CO32 citations92

US6184284B1Feb 6, 2001

Adhesion promoter and self-priming resin compositions and articles made therefrom

DOW CHEMICAL CO34 citations91

US5668210ASep 16, 1997

TOWNSEND III PAUL H

DOW GLOBAL TECHNOLOGIES INC

Composition containing a cross-linkable matrix precursor and a poragen, and a porous matrix prepared therefrom

Composition containing a cross-linkable matrix precursor and a poragen, and a porous matrix prepared therefrom

Composition containing a cross-linkable matrix precursor and a poragen, and porous matrix prepared therefrom

Process for making air gap containing semiconducting devices and resulting semiconducting device

Polyarylene compositions with enhanced modulus profiles

Organosilicate resins as hardmasks for organic polymer dielectrics in fabrication of microelectronic devices

Tri-layer masking architecture for patterning dual damascene interconnects

Composition containing a cross-linkable matrix precursor and a poragen, and a porous matrix prepared therefrom

Low dielectric constant polymers having good adhesion and toughness and articles made with such polymers

Organosilicate resins as hardmasks for organic polymer dielectrics in fabrication of microelectronic devices

DOW CHEMICAL CO

Polyphenylene oligomers and polymers

Polyarylene compositions with enhanced modulus profiles

Adhesion promoter and self-priming resin compositions and articles made therefrom

Adhesion promoter and self-priming arylcyclobutene resin compositions

Adhesion promoter and self-priming arylcyclobutene resin compositions

Method of making an electrical interconnection device