Inventor

KELLY JAMES J

US42 patents

⚠️ This page may combine multiple inventors who share the name “KELLY JAMES J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KELLY JAMES J

IBM

Void-free metallic interconnect structures with self-formed diffusion barrier layers

Fully aligned via employing selective metal deposition

Enlarged contact area structure using noble metal cap and noble metal liner

Hybrid hard mask for damascene and dual damascene

Structure and method for improved stabilization of cobalt cap and/or cobalt liner in interconnects

Planar wafer level fan-out of multi-chip modules having different size chips

Back end of line metallization structure

Back end of line metallization structure

Metal spacer self aligned multi-patterning integration

Stack viabar structures

Ion flow barrier structure for interconnect metallization

Via bottom structure and methods of forming

Superfilled metal contact vias for semiconductor devices

Metal via structure

Stack viabar structures

Dual redistribution layer structure

Bridge chip with through via

Protective surface layer on under bump metallurgy for solder joining

Dual redistribution layer structure

Replacement metal cap by an exchange reaction

Cu—Cu bonding for interconnects on bridge chip attached to chips and packaging substrate

Simultaneous plating of varying size features on semiconductor substrate

Void-free metallic interconnect structures with self-formed diffusion barrier layers

Metal via structure

Wafer backside particle mitigation

Selective silicide formation by electrodeposit displacement reaction

Resist patterned redistribution wiring on copper polyimide via layer

Controllable formation of recessed bottom electrode contact in a memory metallization stack

Metal contact isolation for semiconductor structures

Replacement metal cap by an exchange reaction

Ion flow barrier structure for interconnect metallization

Structure and method for improved stabilization of cobalt cap and/or cobalt liner in interconnects

Wafer backside particle mitigation

Hybrid TIMs for electronic package cooling

KELLY JAMES J

Copper interconnect formation

Superfilled metal contact vias for semiconductor devices

Apparatus for fastening insulation to a pipe

US ENERGY

Inertial energy storage device

WOMCO INC

Steel mill by-product material briquettes and pellets

SANDIA NAT LAB

Apparatus and method for controlling plating uniformity

FONAR INC

Acoustic detection of machinery malfunction

AMERICAN CYANAMID CO

Process for producing 2-(p-chlorophenoxy) aniline