Inventor

Peethala Cornelius Brown

US60 patents

⚠️ This page may combine multiple inventors who share the name “Peethala Cornelius Brown”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

Peethala Cornelius Brown

IBM

Low-resistivity metallic interconnect structures with self-forming diffusion barrier layers

Selective surface modification of interconnect structures

Lithographic photomask alignment using non-planar alignment structures formed on wafer

Enlarged contact area structure using noble metal cap and noble metal liner

Structure and method using metal spacer for insertion of variable wide line implantation in SADP/SAQP integration

Enabling low resistance gates and contacts integrated with bilayer dielectrics

Metal interconnects

Multiple patterning scheme integration with planarized cut patterning

Back end of line metallization structure

Back end of line metallization structure

Metal spacer self aligned multi-patterning integration

Back end of line metallization structures

Hybrid BEOL metallization utilizing selective reflection mask

Low aspect ratio interconnect

Barrier layers in trenches and vias

Skip via for metal interconnects

Selective deposition with SAM for fully aligned via

Metal interconnect structures with self-forming sidewall barrier layer

Multiple patterning scheme integration with planarized cut patterning

Selective deposition and cross-linking of polymeric dielectric material

Etch back and film profile shaping of selective dielectric deposition

Bottom barrier free interconnects without voids

Replacement metal cap by an exchange reaction

Liner and cap structures for reducing local interconnect vertical resistance without compromising reliability

Bottom barrier free interconnects without voids

Dielectric damage-free dual damascene Cu interconnects without barrier at via bottom

Metal interconnects

Hybrid BEOL metallization utilizing selective reflection mask

Back end of line metallization structures

Dielectric damage-free dual damascene Cu interconnects without barrier at via bottom

Cobalt contact and interconnect structures

Cobalt contact and interconnect structures

Dry and wet etch resistance for atomic layer deposited TiO2 for SIT spacer application

Metallic interconnect structure

Planarization of dielectric topography and stopping in dielectric

Controlling performance and reliability of conductive regions in a metallization network

Metallic interconnect structures with wrap around capping layers

Metallic interconnect structures with wrap around capping layers

Adjustable via dimension and chamfer angle

Interconnects having a via-to-line spacer for preventing short circuit events between a conductive via and an adjacent line

Metal spacer self aligned double patterning with airgap integration

Liner and cap structures for reducing local interconnect vertical resistance without compromising reliability

Replacement metal cap by an exchange reaction

Multiple patterning scheme integration with planarized cut patterning

Selective surface modification of interconnect structures

Barrier layers in trenches and vias

Environmentally green process and composition for cobalt wet etch

Embedded metal contamination removal from BEOL wafers

ELPIS TECH INC

Structure and method using metal spacer for insertion of variable wide line implantation in SADP/SAQP integration

TESSERA INC

Low aspect ratio interconnect