Inventor

MATSUURA HIDEKAZU

JP27 patents

⚠️ This page may combine multiple inventors who share the name “MATSUURA HIDEKAZU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MATSUURA HIDEKAZU

HITACHI CHEMICAL CO LTD

Process for fabricating a crack resistant resin encapsulated semiconductor chip package

Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof

Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method for manufacturing semiconductor device

Heat-resistant adhesive sheet

Process for fabricating a crack resistant resin encapsulated semiconductor chip package

Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of polyimides

Adhesive film for semiconductor, lead frame and semiconductor device using the same

Adhesive film for semiconductor, lead frame with adhesive film for semiconductor and semiconductor device using the same

Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufacturing semiconductor device

Process for fabricating a crack resistant resin encapsulated semiconductor chip package

Method of producing a lead frame with composite film attached, and use of the lead frame

Composite film and lead frame with composite film attached

Polyimides and thermosetting resin compositions containing the same

Method for surface treatment of polyimide resin molded articles

Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device

Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device

Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device

Method of forming resin film of desired pattern on semiconductor substrate, semiconductor chip, semiconductor package, and resist image remover

Photosensitive resin composition, process of forming patterns with the same, and electronic components

Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides

Insulating adhesive for electronic parts, and lead frame and semiconductor device using the same

Method of producing a lead frame with composite film attached, and use of the lead frame

Method of forming resin film of desired pattern on semiconductor substrate, semiconductor chip, semiconductor package

Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same

FUJITSU LTD

Virtual computer control system effectively using a CPU with predetermined assignment ratios of resources based on a first and second priority mechanism

Global communication interrupt control system for communication between real and virtual machine systems using global communication functions of a shared memory

System for controlling restoration from failure in queue structure of control data