Inventor

IWAZAKI YOSHIHIDE

JP11 patents

⚠️ This page may combine multiple inventors who share the name “IWAZAKI YOSHIHIDE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HITACHI CHEMICAL CO LTD

6 patents

US6046072AApr 4, 2000

Process for fabricating a crack resistant resin encapsulated semiconductor chip package

HITACHI CHEMICAL CO LTD44 citations95

US6558791B2May 6, 2003

Heat-resistant adhesive sheet

HITACHI CHEMICAL CO LTD16 citations92

US6248613B1Jun 19, 2001

Process for fabricating a crack resistant resin encapsulated semiconductor chip package

HITACHI CHEMICAL CO LTD22 citations92

US6372080B1Apr 16, 2002

Process for fabricating a crack resistant resin encapsulated semiconductor chip package

HITACHI CHEMICAL CO LTD17 citations83

US5955779ASep 21, 1999

Method of forming resin film of desired pattern on semiconductor substrate, semiconductor chip, semiconductor package, and resist image remover

HITACHI CHEMICAL CO LTD5 citations73

US5958653ASep 28, 1999

Method of forming resin film of desired pattern on semiconductor substrate, semiconductor chip, semiconductor package

HITACHI CHEMICAL CO LTD4 citations62

SHARP KK

5 patents

US6838748B2Jan 4, 2005

Semiconductor element with electromagnetic shielding layer on back/side face(s) thereof

SHARP KK70 citations97

US7091616B2Aug 15, 2006

Semiconductor device having a leading wiring layer

SHARP KK42 citations92

US7445958B2Nov 4, 2008

Semiconductor device having a leading wiring layer

SHARP KK6 citations73

US6940175B2Sep 6, 2005

Semiconductor device in which a plurality of electronic components are combined with each other

SHARP KK9 citations73

US6831002B2Dec 14, 2004

Manufacturing method of semiconductor device

SHARP KK0 citations40