Inventor

HUERTAS ROBERT A

US25 patents

⚠️ This page may combine multiple inventors who share the name “HUERTAS ROBERT A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUERTAS ROBERT A

ADVANCED MICRO DEVICES INC

Method of forming low resistance vias

H2-or H2/N2-plasma treatment to prevent organic ILD degradation

Method of reducing metal voidings in 0.25 μm AL interconnect

UV-blocking layer for reducing UV-induced charging of SONOS dual-bit flash memory devices in BEOL

HDP treatment for reduced nickel silicide bridging

HDP deposition hillock suppression method in integrated circuits

Method of improving adhesion of capping layers to cooper interconnects

NH3/N2-plasma treatment for reduced nickel silicide bridging

Low temperature hillock suppression method in integrated circuit interconnects

Monitoring wafer temperature during thermal processing of wafers by measuring sheet resistance of a test wafer

Monitoring wafer temperature during thermal processing of wafers by measuring sheet resistance of a test wafer

Method of forming SiC capped copper interconnects with reduced hillock formation and improved electromigration resistance

Method of forming copper interconnect capping layers with improved interface and adhesion

Multi-stage, low deposition rate PECVD oxide

Ultra low deposition rate PECVD silicon nitride

Nitrogen-plasma treatment for reduced nickel silicide bridging

Process for forming PECVD undoped oxide with a super low deposition rate on a single state deposition

UV-blocking layer for reducing UV-induced charging of SONOS dual-bit flash memory devices in BEOL processing

Method of forming a void-free interlayer dielectric (ILD0) for 0.18-μm flash memory technology and semiconductor device thereby formed

Undoped oxide liner/BPSG for improved data retention

Low dielectric constant etch stop layers in integrated circuit interconnects

Void-free interlayer dielectric (ILD0) for 0.18-micron flash memory semiconductor device

INTERMOLECULAR INC

Vertical oxide-oxide interface for forming-free, low power and low variability RRAM devices

ADVANCED MICRO DEVICES INS

Nitrogen-plasma treatment for reduced nickel silicide bridging

SPANSION LLC

Interlayer dielectric for charge loss improvement