Inventor
LIANG MIKE
US11 patents
⚠️ This page may combine multiple inventors who share the name “LIANG MIKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LSI LOGIC CORP
9 patentsUS5952726ASep 14, 1999
Flip chip bump distribution on die
LSI LOGIC CORP197 citations98
US6480989B2Nov 12, 2002
Integrated circuit design incorporating a power mesh
LSI LOGIC CORP269 citations97
US6457157B1Sep 24, 2002
I/O device layout during integrated circuit design
LSI LOGIC CORP65 citations93
US6225143B1May 1, 2001
Flip-chip integrated circuit routing to I/O devices
LSI LOGIC CORP67 citations93
US6057169AMay 2, 2000
Method for I/O device layout during integrated circuit design
LSI LOGIC CORP43 citations93
US5885855AMar 23, 1999
Method for distributing connection pads on a semiconductor die
LSI LOGIC CORP38 citations92
US6323559B1Nov 27, 2001
Hexagonal arrangements of bump pads in flip-chip integrated circuits
LSI LOGIC CORP45 citations91
US6674166B2Jan 6, 2004
Flip-chip integrated circuit routing to I/O devices
LSI LOGIC CORP17 citations89
US6243849B1Jun 5, 2001
Method and apparatus for netlist filtering and cell placement
LSI LOGIC CORP18 citations81