Inventor
LIAO KUANG-HO
TW6 patents
Patents
6 patentsUS6458617B1Oct 1, 2002
Multi-chip semiconductor package structure
VANGUARD INT SEMICONDUCT CORP42 citations92
US6245598B1Jun 12, 2001
Method for wire bonding a chip to a substrate with recessed bond pads and devices formed
VANGUARD INT SEMICONDUCT CORP36 citations91
US6122822ASep 26, 2000
Method for balancing mold flow in encapsulating devices
VANGUARD INT SEMICONDUCT CORP29 citations90
US6075281AJun 13, 2000
Modified lead finger for wire bonding
VANGUARD INT SEMICONDUCT CORP16 citations83
US6844616B2Jan 18, 2005
Multi-chip semiconductor package structure
VANGUARD INT SEMICONDUCT CORP7 citations73
US6220102B1Apr 24, 2001
Die-shear test fixture apparatus
VANGUARD INT SEMICONDUCT CORP12 citations71