Inventor
REDEKER FRITZ C
US37 patents
⚠️ This page may combine multiple inventors who share the name “REDEKER FRITZ C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
17 patentsUS6951042B1Oct 4, 2005
Brush scrubbing-high frequency resonating wafer processing system and methods for making and implementing the same
LAM RES CORP50 citations96
US7829152B2Nov 9, 2010
Electroless plating method and apparatus
LAM RES CORP18 citations92
US8026605B2Sep 27, 2011
Interconnect structure and method of manufacturing a damascene structure
LAM RES CORP8 citations84
US7810513B1Oct 12, 2010
Substrate preparation using megasonic coupling fluid meniscus and methods, apparatus, and systems for implementing the same
LAM RES CORP10 citations84
US7521358B2Apr 21, 2009
Process integration scheme to lower overall dielectric constant in BEoL interconnect structures
LAM RES CORP11 citations84
US7615486B2Nov 10, 2009
Apparatus and method for integrated surface treatment and deposition for copper interconnect
LAM RES CORP7 citations74
US7032269B2Apr 25, 2006
Brush scrubbing-high frequency resonating substrate processing system
LAM RES CORP7 citations74
US7752996B2Jul 13, 2010
Apparatus for applying a plating solution for electroless deposition
LAM RES CORP4 citations63
US7396430B2Jul 8, 2008
Apparatus and method for confined area planarization
LAM RES CORP2 citations63
US7709400B2May 4, 2010
Thermal methods for cleaning post-CMP wafers
LAM RES CORP2 citations62
US7648616B1Jan 19, 2010
Apparatus and method for semiconductor wafer electroplanarization
LAM RES CORP2 citations62
US7520284B2Apr 21, 2009
Apparatus for developing photoresist and method for operating the same
LAM RES CORP4 citations62
US7806126B1Oct 5, 2010
Substrate proximity drying using in-situ local heating of substrate and substrate carrier point of contact, and methods, apparatus, and systems for implementing the same
LAM RES CORP5 citations61
US7598175B2Oct 6, 2009
Apparatus and method for confined area planarization
LAM RES CORP0 citations52
US9287110B2Mar 15, 2016
Method and apparatus for wafer electroless plating
LAM RES CORP0 citations51
US7884017B2Feb 8, 2011
Thermal methods for cleaning post-CMP wafers
LAM RES CORP0 citations51
US8011116B2Sep 6, 2011
Substrate proximity drying using in-situ local heating of substrate
LAM RES CORP0 citations50
THIE WILLIAM
5 patentsUS8622020B2Jan 7, 2014
Simultaneous electroless plating of two substrates
THIE WILLIAM10 citations83
US8314027B2Nov 20, 2012
Wafer electroless plating system and associated methods
THIE WILLIAM2 citations60
US8485120B2Jul 16, 2013
Method and apparatus for wafer electroless plating
THIE WILLIAM1 citations50
US8069813B2Dec 6, 2011
Wafer electroless plating system and associated methods
THIE WILLIAM1 citations50
US8844461B2Sep 30, 2014
Fluid handling system for wafer electroless plating and associated methods
THIE WILLIAM0 citations39
YOON HYUNGSUK ALEXANDER
4 patentsUS8916232B2Dec 23, 2014
Method for barrier interface preparation of copper interconnect
YOON HYUNGSUK ALEXANDER9 citations84
US8287647B2Oct 16, 2012
Apparatus and method for atomic layer deposition
YOON HYUNGSUK ALEXANDER12 citations84
US8623456B2Jan 7, 2014
Methods for atomic layer deposition
YOON HYUNGSUK ALEXANDER2 citations62
US9359673B2Jun 7, 2016
Apparatus and method for atomic layer deposition
YOON HYUNGSUK ALEXANDER0 citations52
DORDI YEZDI
3 patentsUS8771804B2Jul 8, 2014
Processes and systems for engineering a copper surface for selective metal deposition
DORDI YEZDI16 citations83
US8241701B2Aug 14, 2012
Processes and systems for engineering a barrier surface for copper deposition
DORDI YEZDI16 citations83
US8747960B2Jun 10, 2014
Processes and systems for engineering a silicon-type surface for selective metal deposition to form a metal silicide
DORDI YEZDI11 citations81
FREER ERIK M
3 patentsUS8480810B2Jul 9, 2013
Method and apparatus for particle removal
FREER ERIK M5 citations73
US8475599B2Jul 2, 2013
Substrate preparation using stabilized fluid solutions and methods for making stable fluid solutions
FREER ERIK M6 citations73
US8388762B2Mar 5, 2013
Substrate cleaning technique employing multi-phase solution
FREER ERIK M2 citations62