Inventor
SHINMA YASUHIRO
JP24 patents
⚠️ This page may combine multiple inventors who share the name “SHINMA YASUHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SPANSION LLC
10 patentsUS7605457B2Oct 20, 2009
Semiconductor device and method of manufacturing the same
SPANSION LLC18 citations92
US7285848B2Oct 23, 2007
Carrier for stacked type semiconductor device and method of fabricating the same
SPANSION LLC19 citations92
US8030179B2Oct 4, 2011
Semiconductor device and method of manufacturing the same
SPANSION LLC8 citations83
US7696616B2Apr 13, 2010
Stacked type semiconductor device and method of fabricating stacked type semiconductor device
SPANSION LLC4 citations63
US7642637B2Jan 5, 2010
Carrier for stacked type semiconductor device and method of fabricating the same
SPANSION LLC2 citations63
US7622067B2Nov 24, 2009
Apparatus and method for manufacturing a semiconductor device
SPANSION LLC3 citations63
US7851260B2Dec 14, 2010
Method for manufacturing a semiconductor device
SPANSION LLC1 citations52
US7489029B2Feb 10, 2009
Carrier structure for stacked-type semiconductor device, method of producing the same, and method of fabricating stacked-type semiconductor device
SPANSION LLC1 citations52
US7846771B2Dec 7, 2010
Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices
SPANSION LLC0 citations51
US7414305B2Aug 19, 2008
Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices
SPANSION LLC0 citations51
FUJITSU LTD
9 patentsUS6881611B1Apr 19, 2005
Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device
FUJITSU LTD85 citations98
US6563207B2May 13, 2003
Split-mold and method for manufacturing semiconductor device by using the same
FUJITSU LTD62 citations96
US6511620B1Jan 28, 2003
Method of producing semiconductor devices having easy separability from a metal mold after molding
FUJITSU LTD35 citations92
US6471501B1Oct 29, 2002
Mold for fabricating semiconductor devices
FUJITSU LTD53 citations92
US6469370B1Oct 22, 2002
Semiconductor device and method of production of the semiconductor device
FUJITSU LTD54 citations92
US6022759AFeb 8, 2000
Method for producing a semiconductor device, base member for semiconductor device and semiconductor device unit
FUJITSU LTD31 citations92
US5747874AMay 5, 1998
Semiconductor device, base member for semiconductor device and semiconductor device unit
FUJITSU LTD37 citations92
US6444500B1Sep 3, 2002
Split-mold and method for manufacturing semiconductor device by using the same
FUJITSU LTD8 citations74
US6515347B1Feb 4, 2003
Wafer level semiconductor device and method of manufacturing the same
FUJITSU LTD7 citations73