Inventor
KAWAHARA TOSHIMI
JP26 patents
⚠️ This page may combine multiple inventors who share the name “KAWAHARA TOSHIMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
22 patentsUS6376921B1Apr 23, 2002
Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame
FUJITSU LTD120 citations99
US6881611B1Apr 19, 2005
Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device
FUJITSU LTD85 citations98
US6573121B2Jun 3, 2003
Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame
FUJITSU LTD126 citations98
US6329711B1Dec 11, 2001
Semiconductor device and mounting structure
FUJITSU LTD122 citations96
US4788583ANov 29, 1988
Semiconductor device and method of producing semiconductor device
FUJITSU LTD72 citations96
US5679978AOct 21, 1997
Semiconductor device having resin gate hole through substrate for resin encapsulation
FUJITSU LTD96 citations95
US6541848B2Apr 1, 2003
Semiconductor device including stud bumps as external connection terminals
FUJITSU LTD58 citations94
US6379997B1Apr 30, 2002
Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same
FUJITSU LTD54 citations94
US6111306AAug 29, 2000
Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same
FUJITSU LTD83 citations94
US6696754B2Feb 24, 2004
Semiconductor module including a plurality of semiconductor devices detachably
FUJITSU LTD20 citations92
US6563330B1May 13, 2003
Probe card and method of testing wafer having a plurality of semiconductor devices
FUJITSU LTD37 citations92
US6511620B1Jan 28, 2003
Method of producing semiconductor devices having easy separability from a metal mold after molding
FUJITSU LTD35 citations92
US6507092B1Jan 14, 2003
Semiconductor device having increased reliability and method of producing the same and semiconductor chip suitable for such a semiconductor device and method of producing the same
FUJITSU LTD21 citations92
US6472744B2Oct 29, 2002
Semiconductor module including a plurality of semiconductor devices detachably
FUJITSU LTD31 citations92
US6469370B1Oct 22, 2002
Semiconductor device and method of production of the semiconductor device
FUJITSU LTD54 citations92
US6437432B2Aug 20, 2002
Semiconductor device having improved electrical characteristics and method of producing the same
FUJITSU LTD30 citations92
US6207477B1Mar 27, 2001
Semiconductor device having a ball grid array and a fabrication process thereof
FUJITSU LTD37 citations92
US5844309ADec 1, 1998
Adhesive composition, semiconductor device using the composition and method for producing a semiconductor device using the composition
FUJITSU LTD46 citations92
US5616164AApr 1, 1997
Methods for making metal particle spherical and removing oxide film solder paste and soldering method
FUJITSU LTD18 citations83
US6774650B2Aug 10, 2004
Probe card and method of testing wafer having a plurality of semiconductor devices
FUJITSU LTD7 citations73
US6515347B1Feb 4, 2003
Wafer level semiconductor device and method of manufacturing the same
FUJITSU LTD7 citations73
US6034428AMar 7, 2000
Semiconductor integrated circuit device having stacked wiring and insulating layers
FUJITSU LTD9 citations72