Inventor

TANAKA YASUNORI

JP84 patents

⚠️ This page may combine multiple inventors who share the name “TANAKA YASUNORI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TANAKA YASUNORI

TOSHIBA KK

Slew-rate limited output driver having reduced switching noise

Semiconductor input/output circuits operating at different power supply voltages

CMOS output buffer with pre-drive circuitry to control slew rate of main drive transistors

Buffer circuit having a voltage drop means for the purpose of reducing peak current and through-current

CMOS output circuit device

Gate array semiconductor circuit device, input circuit, output circuit and voltage lowering circuit

Interface circuit between different potential levels

LSI chip having programmable buffer circuit

Output circuit device preventing overshoot and undershoot

Semiconductor integrated circuit device having pads at periphery of semiconductor chip

Level conversion circuit and semiconductor integrated circuit

Semiconductor integrated circuit for suppressing overshooting and ringing

Master slice type semiconductor integrated circuit having 2 or more I/O cells per connection pad

Charge pump circuit and step-down regulator circuit

FUJI PHOTO FILM CO LTD

Transfer apparatus

Coating apparatus

Coating method

Coating apparatus

Coating apparatus

Magnetic liquid application method and apparatus

Magnetic liquid application method and apparatus

Apparatus for removing foreign matter from flexible support

Coating method

Process for preparing magnetic recording medium

NEC CORP

Bear chip mounting printed circuit board and a method of manufacturing thereof by photoetching

Structure and method for mounting a saw device

Semiconductor device with improved connection reliability

High-strength solder joint

High-strength solder joint

Semiconductor device mounting and multi-chip module

Printing wiring board

Chip package device mountable on a mother board in whichever of facedown and wire bonding manners

Chip package device mountable on a mother board in whichever of facedown and wire bonding manners

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Mobile communication apparatus with improved base station monitoring

Radio-calling device capable of setting flexibly output mode

Electronic mail system

FUJI ELECTRIC CO LTD

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device

Method of manufacturing semiconductor device

YAZAKI CORP

Inrush current limiting circuit

FUJINON CORP

Multi-focus camera apparatus and image processing method and program used therein

TANAKA YASUNORI

Surveillance camera apparatus and surveillance camera system

KOYO THERMO SYS CO LTD

Vacuum heat treating method and apparatus therefor

HITACHI CONSTRUCTION MACH CO

Traveling drive device for dump truck

TOMITA YOSHIAKI

Bottle capping apparatus

MASUDA MASACHIKA

Semiconductor device and manufacturing method therefor

NITTO SHINKO CORP

Laminate sheet

DUPONT TEIJIN ADVANCED PAPERS JAPAN LTD

Electromagnetic wave suppression sheet

KOMATSU IND CORP

Plasma cutting machine and cutting method

FUJIFILM CORP

Image transfer apparatus