Inventor
BOSAK HENRY C
US3 patents
Patents
3 patentsUS9743558B2Aug 22, 2017
Automatic height compensating and co-planar leveling heat removal assembly for multi-chip packages
INTEL CORP12 citations79
US10141241B2Nov 27, 2018
Multi-chip self adjusting cooling solution
INTEL CORP0 citations36
US10365046B2Jul 30, 2019
Server thermal management with heat pipes
INTEL CORP0 citations35