Inventor
OHSUMI TAKASHI
JP20 patents
⚠️ This page may combine multiple inventors who share the name “OHSUMI TAKASHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
OKI ELECTRIC IND CO LTD
15 patentsUS6765299B2Jul 20, 2004
Semiconductor device and the method for manufacturing the same
OKI ELECTRIC IND CO LTD166 citations99
US6097091AAug 1, 2000
Semiconductor apparatus having an insulating layer of varying height therein
OKI ELECTRIC IND CO LTD55 citations96
US7045908B2May 16, 2006
Semiconductor device and method for manufacturing the same
OKI ELECTRIC IND CO LTD30 citations92
US6893943B2May 17, 2005
Method of dividing a semiconductor wafer
OKI ELECTRIC IND CO LTD19 citations92
US6841875B2Jan 11, 2005
Semiconductor device
OKI ELECTRIC IND CO LTD51 citations92
US6590274B2Jul 8, 2003
Semiconductor wafer and method for manufacturing semiconductor devices
OKI ELECTRIC IND CO LTD14 citations92
US6303470B1Oct 16, 2001
Semiconductor wafer and method for manufacturing semiconductor devices
OKI ELECTRIC IND CO LTD21 citations92
US6281111B1Aug 28, 2001
Semiconductor apparatus and method for fabricating the same
OKI ELECTRIC IND CO LTD21 citations92
US7358608B2Apr 15, 2008
Semiconductor device having chip size package with improved strength
OKI ELECTRIC IND CO LTD10 citations84
US7129579B2Oct 31, 2006
Semiconductor apparatus and method for fabricating the same
OKI ELECTRIC IND CO LTD6 citations73
US6713319B2Mar 30, 2004
Method for fabricating a semiconductor apparatus including a sealing member with reduced thermal stress
OKI ELECTRIC IND CO LTD9 citations73
US6331449B1Dec 18, 2001
Method of forming a dicing area of a semicondutor substrate
OKI ELECTRIC IND CO LTD7 citations73
US7180185B2Feb 20, 2007
Semiconductor device with connections for bump electrodes
OKI ELECTRIC IND CO LTD3 citations62
US6979592B2Dec 27, 2005
Method for fabricating a semiconductor apparatus including a sealing member with reduced thermal stress
OKI ELECTRIC IND CO LTD2 citations62
US6852617B2Feb 8, 2005
Semiconductor device fabrication method
OKI ELECTRIC IND CO LTD0 citations52
OKI SEMICONDUCTOR CO LTD
3 patentsUS7528005B2May 5, 2009
Method of manufacturing chip size package semiconductor device without intermediate substrate
OKI SEMICONDUCTOR CO LTD9 citations84
US7915746B2Mar 29, 2011
Semiconductor wafer, and semiconductor device formed therefrom
OKI SEMICONDUCTOR CO LTD4 citations62
US7667315B2Feb 23, 2010
Semiconductor device having a frame portion and an opening portion with mountable semiconductor chips therein
OKI SEMICONDUCTOR CO LTD1 citations52