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Inventor
JEN SAIHSI
TW
2 patents
⚠️ This page may combine multiple inventors who share the name “JEN SAIHSI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TEXAS INSTRUMENTS INC
1 patent
US8546184B2
Oct 1, 2013
Package substrate having die pad with outer raised portion and interior recessed portion
TEXAS INSTRUMENTS INC
0 citations
47
HO CHIH-CHIEN
1 patent
US8455989B2
Jun 4, 2013
Package substrate having die pad with outer raised portion and interior recessed portion
HO CHIH-CHIEN
1 citations
40