Inventor
REEDER WILLIAM J
US9 patents
Patents
9 patentsUS6984545B2Jan 10, 2006
Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask
MICRON TECHNOLOGY INC72 citations97
US6577004B1Jun 10, 2003
Solder ball landpad design to improve laminate performance
MICRON TECHNOLOGY INC75 citations96
US7125748B2Oct 24, 2006
Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask
MICRON TECHNOLOGY INC21 citations92
US6577019B1Jun 10, 2003
Alignment and orientation features for a semiconductor package
MICRON TECHNOLOGY INC20 citations92
US7138724B2Nov 21, 2006
Thick solder mask for confining encapsulant material over selected locations of a substrate and assemblies including the solder mask
MICRON TECHNOLOGY INC11 citations83
US6869869B2Mar 22, 2005
Alignment and orientation features for a semiconductor package
MICRON TECHNOLOGY INC7 citations73
US7229905B2Jun 12, 2007
Alignment and orientation features for a semiconductor package
MICRON TECHNOLOGY INC1 citations62
US7416913B2Aug 26, 2008
Methods of manufacturing microelectronic imaging units with discrete standoffs
MICRON TECHNOLOGY INC1 citations52
US7417294B2Aug 26, 2008
Microelectronic imaging units and methods of manufacturing microelectronic imaging units
MICRON TECHNOLOGY INC0 citations52