Inventor
MESS LEONARD E
US45 patents
⚠️ This page may combine multiple inventors who share the name “MESS LEONARD E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
42 patentsUS7262506B2Aug 28, 2007
Stacked mass storage flash memory package
MICRON TECHNOLOGY INC85 citations99
US6900528B2May 31, 2005
Stacked mass storage flash memory package
MICRON TECHNOLOGY INC229 citations99
US6414391B1Jul 2, 2002
Module assembly for stacked BGA packages with a common bus bar in the assembly
MICRON TECHNOLOGY INC87 citations99
US6297548B1Oct 2, 2001
Stackable ceramic FBGA for high thermal applications
MICRON TECHNOLOGY INC259 citations99
US6297960B1Oct 2, 2001
Heat sink with alignment and retaining features
MICRON TECHNOLOGY INC155 citations99
US6294839B1Sep 25, 2001
Apparatus and methods of packaging and testing die
MICRON TECHNOLOGY INC352 citations99
US6563217B2May 13, 2003
Module assembly for stacked BGA packages
MICRON TECHNOLOGY INC76 citations98
US7704794B2Apr 27, 2010
Method of forming a semiconductor device
MICRON TECHNOLOGY INC43 citations96
US6838768B2Jan 4, 2005
Module assembly for stacked BGA packages
MICRON TECHNOLOGY INC35 citations96
US6760224B2Jul 6, 2004
Heat sink with alignment and retaining features
MICRON TECHNOLOGY INC60 citations96
US6650007B2Nov 18, 2003
Stackable ceramic fbga for high thermal applications
MICRON TECHNOLOGY INC36 citations96
US6512302B2Jan 28, 2003
Apparatus and methods of packaging and testing die
MICRON TECHNOLOGY INC46 citations96
US6380631B2Apr 30, 2002
Apparatus and methods of packaging and testing die
MICRON TECHNOLOGY INC37 citations96
US6291265B1Sep 18, 2001
Method of manufacturing an interposer
MICRON TECHNOLOGY INC39 citations96
US6224936B1May 1, 2001
Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board
MICRON TECHNOLOGY INC47 citations96
US6007317ADec 28, 1999
Ball grid array (BGA) encapsulation mold
MICRON TECHNOLOGY INC38 citations96
US7829991B2Nov 9, 2010
Stackable ceramic FBGA for high thermal applications
MICRON TECHNOLOGY INC17 citations93
US7408255B2Aug 5, 2008
Assembly for stacked BGA packages
MICRON TECHNOLOGY INC12 citations93
US7400032B2Jul 15, 2008
Module assembly for stacked BGA packages
MICRON TECHNOLOGY INC12 citations93
US7375419B2May 20, 2008
Stacked mass storage flash memory package
MICRON TECHNOLOGY INC19 citations93
US6858926B2Feb 22, 2005
Stackable ceramic FBGA for high thermal applications
MICRON TECHNOLOGY INC24 citations93
US6777965B1Aug 17, 2004
Interposer for electrically coupling a semiconductive device to an electrical apparatus
MICRON TECHNOLOGY INC19 citations93
US6592670B1Jul 15, 2003
Apparatus for reducing warpage during application and curing of encapsulant materials on a printed circuit board
MICRON TECHNOLOGY INC15 citations93
US6558966B2May 6, 2003
Apparatus and methods of packaging and testing die
MICRON TECHNOLOGY INC27 citations93
US6527999B2Mar 4, 2003
Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board
MICRON TECHNOLOGY INC13 citations93
US6525943B2Feb 25, 2003
Heat sink with alignment and retaining features
MICRON TECHNOLOGY INC36 citations93
US6472252B2Oct 29, 2002
Methods for ball grid array (BGA) encapsulation mold
MICRON TECHNOLOGY INC21 citations93
US5923959AJul 13, 1999
Ball grid array (BGA) encapsulation mold
MICRON TECHNOLOGY INC25 citations93
US6577019B1Jun 10, 2003
Alignment and orientation features for a semiconductor package
MICRON TECHNOLOGY INC20 citations92
US6830719B2Dec 14, 2004
Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board
MICRON TECHNOLOGY INC11 citations82
US7285442B2Oct 23, 2007
Stackable ceramic FBGA for high thermal applications
MICRON TECHNOLOGY INC6 citations74
US7279797B2Oct 9, 2007
Module assembly and method for stacked BGA packages
MICRON TECHNOLOGY INC4 citations74
US7166252B2Jan 23, 2007
Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board
MICRON TECHNOLOGY INC8 citations74
US6764549B2Jul 20, 2004
Method and apparatus for reducing warpage during application and curing of encapsulant materials on a printed circuit board
MICRON TECHNOLOGY INC9 citations74
US6335221B1Jan 1, 2002
Ball grid array (BGA) encapsulation mold
MICRON TECHNOLOGY INC12 citations74
US6164946ADec 26, 2000
Ball grid array (BGA) encapsulation mold
MICRON TECHNOLOGY INC12 citations74
US6869869B2Mar 22, 2005
Alignment and orientation features for a semiconductor package
MICRON TECHNOLOGY INC7 citations73
US6864700B2Mar 8, 2005
System for electronically coupling a device to an electrical apparatus
MICRON TECHNOLOGY INC3 citations63
US6815261B2Nov 9, 2004
Encapsulation method in a molding machine for an electronic device
MICRON TECHNOLOGY INC4 citations63
US6690188B2Feb 10, 2004
Method of testing a semiconductor device
MICRON TECHNOLOGY INC3 citations63
US7229905B2Jun 12, 2007
Alignment and orientation features for a semiconductor package
MICRON TECHNOLOGY INC1 citations62
US7396702B2Jul 8, 2008
Module assembly and method for stacked BGA packages
MICRON TECHNOLOGY INC0 citations52
ROUND ROCK RES LLC
3 patentsUS8049342B2Nov 1, 2011
Semiconductor device and method of fabrication thereof
ROUND ROCK RES LLC5 citations74
US7998792B2Aug 16, 2011
Semiconductor device assemblies, electronic devices including the same and assembly methods
ROUND ROCK RES LLC3 citations74
US7999378B2Aug 16, 2011
Semiconductor devices including semiconductor dice in laterally offset stacked arrangement
ROUND ROCK RES LLC6 citations74