Inventor
GARDELL DAVID L
US39 patents
⚠️ This page may combine multiple inventors who share the name “GARDELL DAVID L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
29 patentsUS6050326AApr 18, 2000
Method and apparatus for cooling an electronic device
IBM103 citations97
US6275051B1Aug 14, 2001
Segmented architecture for wafer test and burn-in
IBM127 citations96
US6086387AJul 11, 2000
Cover assembly for a socket adaptable to IC modules of varying thickness used for burn-in testing
IBM114 citations94
US5585600ADec 17, 1996
Encapsulated semiconductor chip module and method of forming the same
IBM57 citations94
US5628889AMay 13, 1997
High power capacity magnetron cathode
IBM34 citations92
US6504392B2Jan 7, 2003
Actively controlled heat sink for convective burn-in oven
IBM38 citations89
US6173760B1Jan 16, 2001
Co-axial bellows liquid heatsink for high power module test
IBM22 citations84
US6720789B1Apr 13, 2004
Method for wafer test and wafer test system for implementing the method
IBM19 citations83
US7567090B2Jul 28, 2009
Liquid recovery, collection method and apparatus in a non-recirculating test and burn-in application
IBM9 citations80
US6577146B2Jun 10, 2003
Method of burning in an integrated circuit chip package
IBM16 citations79
US7259580B2Aug 21, 2007
Method and apparatus for temporary thermal coupling of an electronic device to a heat sink during test
IBM15 citations78
US7084651B2Aug 1, 2006
Probe card assembly
IBM10 citations71
US9797928B2Oct 24, 2017
Probe card assembly
IBM2 citations70
US7684194B2Mar 23, 2010
Systems and methods for cooling an electronic device
IBM3 citations63
US5252062AOct 12, 1993
Thermal processing furnace
IBM17 citations63
US9116200B2Aug 25, 2015
Methodologies and test configurations for testing thermal interface materials
IBM2 citations61
US11085949B2Aug 10, 2021
Probe card assembly
IBM0 citations59
US8002025B2Aug 23, 2011
Containment of a wafer-chuck thermal interface fluid
IBM6 citations57
US7808099B2Oct 5, 2010
Liquid thermal interface having mixture of linearly structured polymer doped crosslinked networks and related method
IBM3 citations57
US6590404B2Jul 8, 2003
Force and centrality measuring tool
IBM6 citations54
US9086433B2Jul 21, 2015
Rigid probe with compliant characteristics
IBM0 citations51
US9081034B2Jul 14, 2015
Rigid probe with compliant characteristics
IBM0 citations51
US10578648B2Mar 3, 2020
Probe card assembly
IBM0 citations49
US7265561B2Sep 4, 2007
Device burn in utilizing voltage control
IBM1 citations49
US10571490B2Feb 25, 2020
Solder bump array probe tip structure for laser cleaning
IBM0 citations48
US9835653B2Dec 5, 2017
Solder bump array probe tip structure for laser cleaning
IBM0 citations48
US7964542B2Jun 21, 2011
Enhanced thermo-oxidative stability thermal interface compositions and use thereof in microelectronics assembly
IBM1 citations47
US7332927B2Feb 19, 2008
Apparatus for temporary thermal coupling of an electronic device to a heat sink during test
IBM0 citations45
US10288645B2May 14, 2019
Organic probe substrate
IBM0 citations31
GLOBALFOUNDRIES INC
4 patentsUS10732202B2Aug 4, 2020
Repairable rigid test probe card assembly
GLOBALFOUNDRIES INC1 citations54
US10514393B2Dec 24, 2019
Gimbal assembly test system and method
GLOBALFOUNDRIES INC0 citations50
US10041976B2Aug 7, 2018
Gimbal assembly test system and method
GLOBALFOUNDRIES INC1 citations50
US10429414B2Oct 1, 2019
Multiple contact probe head disassembly method and system
GLOBALFOUNDRIES INC0 citations45