Inventor
GASCHKE PAUL M
US11 patents
Patents
11 patentsUS6275051B1Aug 14, 2001
Segmented architecture for wafer test and burn-in
IBM127 citations96
US6411112B1Jun 25, 2002
Off-axis contact tip and dense packing design for a fine pitch probe
IBM75 citations94
US6086387AJul 11, 2000
Cover assembly for a socket adaptable to IC modules of varying thickness used for burn-in testing
IBM114 citations94
US5001423AMar 19, 1991
Dry interface thermal chuck temperature control system for semiconductor wafer testing
IBM210 citations93
US5186238AFeb 16, 1993
Liquid film interface cooling chuck for semiconductor wafer processing
IBM48 citations92
US5088006AFeb 11, 1992
Liquid film interface cooling system for semiconductor wafer processing
IBM32 citations92
US6426636B1Jul 30, 2002
Wafer probe interface arrangement with nonresilient probe elements and support structure
IBM37 citations86
US6967556B2Nov 22, 2005
High power space transformer
IBM12 citations84
US7259580B2Aug 21, 2007
Method and apparatus for temporary thermal coupling of an electronic device to a heat sink during test
IBM15 citations78
US6196866B1Mar 6, 2001
Vertical probe housing
IBM10 citations73
US7332927B2Feb 19, 2008
Apparatus for temporary thermal coupling of an electronic device to a heat sink during test
IBM0 citations45