Inventor
RUMSEY BRAD D
US32 patents
⚠️ This page may combine multiple inventors who share the name “RUMSEY BRAD D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
30 patentsUS6415977B1Jul 9, 2002
Method and apparatus for marking and identifying a defective die site
MICRON TECHNOLOGY INC80 citations98
US6210992B1Apr 3, 2001
Controlling packaging encapsulant leakage
MICRON TECHNOLOGY INC172 citations98
US6668449B2Dec 30, 2003
Method of making a semiconductor device having an opening in a solder mask
MICRON TECHNOLOGY INC63 citations96
US6644949B2Nov 11, 2003
Apparatus for reduced flash encapsulation of microelectronic devices
MICRON TECHNOLOGY INC51 citations96
US6638595B2Oct 28, 2003
Method and apparatus for reduced flash encapsulation of microelectronic devices
MICRON TECHNOLOGY INC52 citations96
US6577004B1Jun 10, 2003
Solder ball landpad design to improve laminate performance
MICRON TECHNOLOGY INC75 citations96
US6365434B1Apr 2, 2002
Method and apparatus for reduced flash encapsulation of microelectronic devices
MICRON TECHNOLOGY INC67 citations96
US6889902B2May 10, 2005
Descriptor for identifying a defective die site and methods of formation
MICRON TECHNOLOGY INC20 citations92
US6521980B1Feb 18, 2003
Controlling packaging encapsulant leakage
MICRON TECHNOLOGY INC25 citations92
US6518678B2Feb 11, 2003
Apparatus and method for reducing interposer compression during molding process
MICRON TECHNOLOGY INC26 citations92
US6356452B1Mar 12, 2002
Soldermask opening to prevent delamination
MICRON TECHNOLOGY INC14 citations92
US7115819B1Oct 3, 2006
Positioning flowable solder for bonding integrated circuit elements
MICRON TECHNOLOGY INC15 citations84
US7146720B2Dec 12, 2006
Fabricating a carrier substrate by using a solder resist opening as a combination pin one indicator and fiducial
MICRON TECHNOLOGY INC10 citations82
US7335571B2Feb 26, 2008
Method of making a semiconductor device having an opening in a solder mask
MICRON TECHNOLOGY INC5 citations74
US7255273B2Aug 14, 2007
Descriptor for identifying a defective die site
MICRON TECHNOLOGY INC8 citations74
US7127365B2Oct 24, 2006
Method for identifying a defective die site
MICRON TECHNOLOGY INC7 citations74
US7019223B2Mar 28, 2006
Solder resist opening to define a combination pin one indicator and fiducial
MICRON TECHNOLOGY INC5 citations74
US7013559B2Mar 21, 2006
Method of fabricating a semiconductor device package
MICRON TECHNOLOGY INC5 citations74
US6984894B2Jan 10, 2006
Semiconductor package having a partial slot cover for encapsulation process
MICRON TECHNOLOGY INC6 citations74
US6690086B2Feb 10, 2004
Apparatus and method for reducing interposer compression during molding process
MICRON TECHNOLOGY INC6 citations74
US6634099B2Oct 21, 2003
Soldermask opening to prevent delamination
MICRON TECHNOLOGY INC4 citations74
US6395579B2May 28, 2002
Controlling packaging encapsulant leakage
MICRON TECHNOLOGY INC10 citations73
US6914326B2Jul 5, 2005
Solder ball landpad design to improve laminate performance
MICRON TECHNOLOGY INC11 citations71
US7307850B2Dec 11, 2007
Soldermask opening to prevent delamination
MICRON TECHNOLOGY INC3 citations63
US7088590B2Aug 8, 2006
Soldermask opening to prevent delamination
MICRON TECHNOLOGY INC3 citations63
US6790708B2Sep 14, 2004
Encapsulation process using a partial slot cover and a package formed by the process
MICRON TECHNOLOGY INC3 citations63
US6734372B2May 11, 2004
Gate area relief strip for a molded I/C package
MICRON TECHNOLOGY INC2 citations63
US6671182B2Dec 30, 2003
Soldermask opening to prevent delamination
MICRON TECHNOLOGY INC2 citations63
US7263768B2Sep 4, 2007
Method of making a semiconductor device having an opening in a solder mask
MICRON TECHNOLOGY INC0 citations52
US6577015B1Jun 10, 2003
Partial slot cover for encapsulation process
MICRON TECHNOLOGY INC0 citations52