Inventor
KARUPPIAH LAKSHMANAN
US35 patents
⚠️ This page may combine multiple inventors who share the name “KARUPPIAH LAKSHMANAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
21 patentsUS7409260B2Aug 5, 2008
Substrate thickness measuring during polishing
APPLIED MATERIALS INC60 citations98
US7774086B2Aug 10, 2010
Substrate thickness measuring during polishing
APPLIED MATERIALS INC22 citations93
US7444198B2Oct 28, 2008
Determining physical property of substrate
APPLIED MATERIALS INC17 citations92
US7210981B2May 1, 2007
Smart conditioner rinse station
APPLIED MATERIALS INC18 citations92
US7952708B2May 31, 2011
High throughput measurement system
APPLIED MATERIALS INC13 citations84
US7840375B2Nov 23, 2010
Methods and apparatus for generating a library of spectra
APPLIED MATERIALS INC12 citations84
US7746485B2Jun 29, 2010
Determining physical property of substrate
APPLIED MATERIALS INC6 citations74
US9711381B2Jul 18, 2017
Methods and apparatus for post-chemical mechanical planarization substrate cleaning
APPLIED MATERIALS INC2 citations73
US7611400B2Nov 3, 2009
Smart conditioner rinse station
APPLIED MATERIALS INC7 citations73
US9472475B2Oct 18, 2016
Feedback control using detection of clearance and adjustment for uniform topography
APPLIED MATERIALS INC2 citations63
US8874250B2Oct 28, 2014
Spectrographic monitoring of a substrate during processing using index values
APPLIED MATERIALS INC1 citations63
US8813293B2Aug 26, 2014
Apparatus and methods for brush and pad conditioning
APPLIED MATERIALS INC2 citations63
US8014004B2Sep 6, 2011
Determining physical property of substrate
APPLIED MATERIALS INC4 citations63
US7914363B2Mar 29, 2011
Smart conditioner rinse station
APPLIED MATERIALS INC3 citations62
US7422982B2Sep 9, 2008
Method and apparatus for electroprocessing a substrate with edge profile control
APPLIED MATERIALS INC2 citations62
US11908718B2Feb 20, 2024
In-situ metrology and process control
APPLIED MATERIALS INC0 citations61
US11289352B2Mar 29, 2022
In-situ metrology and process control
APPLIED MATERIALS INC0 citations61
US7344432B2Mar 18, 2008
Conductive pad with ion exchange membrane for electrochemical mechanical polishing
APPLIED MATERIALS INC3 citations60
US9431267B2Aug 30, 2016
Semiconductor device processing tools and methods for patterning substrates
APPLIED MATERIALS INC2 citations57
US7520968B2Apr 21, 2009
Conductive pad design modification for better wafer-pad contact
APPLIED MATERIALS INC1 citations51
US7504018B2Mar 17, 2009
Electrochemical method for Ecmp polishing pad conditioning
APPLIED MATERIALS INC1 citations51