Inventor
TAKASHIMA NAGAMITSU
JP30 patents
⚠️ This page may combine multiple inventors who share the name “TAKASHIMA NAGAMITSU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEIKO EPSON CORP
27 patentsUS5872583AFeb 16, 1999
Using fusible films having windows supplied with adhesive and gap material
SEIKO EPSON CORP58 citations95
US6584687B1Jul 1, 2003
Method of manufacturing an ink-jet recording head using a thermally fusible film that does not close communication holes
SEIKO EPSON CORP23 citations92
US7610938B2Nov 3, 2009
Cylindrical rod and method for manufacturing the same
SEIKO EPSON CORP30 citations88
US7165433B2Jan 23, 2007
Method of manufacturing a chamber plate for a liquid ejection head
SEIKO EPSON CORP12 citations83
US7100415B2Sep 5, 2006
Method and apparatus for manufacturing a liquid ejection head
SEIKO EPSON CORP14 citations83
US6968616B2Nov 29, 2005
Method of manufacturing nozzle plate
SEIKO EPSON CORP10 citations74
US7708390B2May 4, 2010
Method of working small recess portion, method of fabricating liquid ejection head and liquid ejection head
SEIKO EPSON CORP6 citations73
US7219983B2May 22, 2007
Fine forging method, manufacturing method of liquid ejection head, and liquid ejection head
SEIKO EPSON CORP6 citations73
US7040134B2May 9, 2006
Punch for forging a liquid ejection head
SEIKO EPSON CORP7 citations73
US7021749B2Apr 4, 2006
Liquid ejection head, and method of manufacturing the same
SEIKO EPSON CORP9 citations73
US6968723B2Nov 29, 2005
Method of punching small hole and method of manufacturing liquid ejection head using the same
SEIKO EPSON CORP9 citations73
US7480993B2Jan 27, 2009
Method of manufacturing a nozzle plate
SEIKO EPSON CORP2 citations63
US7905431B2Mar 15, 2011
Forging punch, method of manufacturing liquid ejection head using the same, and liquid ejection head manufactured by the method
SEIKO EPSON CORP2 citations62
US7575305B2Aug 18, 2009
Liquid ejection head having improved ejection performance
SEIKO EPSON CORP4 citations62
US7546757B2Jun 16, 2009
Method of working small recess portion
SEIKO EPSON CORP3 citations62
US7363795B2Apr 29, 2008
Guided punching apparatus
SEIKO EPSON CORP2 citations62
US7254976B2Aug 14, 2007
Method of manufacturing liquid ejection head
SEIKO EPSON CORP2 citations62
US7249484B2Jul 31, 2007
Method for manufacturing a liquid ejection head
SEIKO EPSON CORP4 citations62
US7194886B2Mar 27, 2007
Method for forging plate and method for manufacturing a liquid ejection head
SEIKO EPSON CORP4 citations62
US7127929B2Oct 31, 2006
Forging work method
SEIKO EPSON CORP2 citations62
US7052119B2May 30, 2006
Liquid ejection head, and method of manufacturing the same
SEIKO EPSON CORP4 citations62
US6997027B2Feb 14, 2006
Forging punch
SEIKO EPSON CORP4 citations62
US7669329B2Mar 2, 2010
Apparatus of fabricating and method of fabricating liquid ejection head, and liquid ejection head
SEIKO EPSON CORP4 citations60
US7543381B2Jun 9, 2009
Method of manufacturing a liquid ejecting head
SEIKO EPSON CORP6 citations60
US8998387B2Apr 7, 2015
Method of working small recess portion, method of fabricating liquid ejection head and liquid ejection head
SEIKO EPSON CORP0 citations51
US7814640B2Oct 19, 2010
Manufacturing method of die for manufacturing liquid ejecting head, and material block used in the same
SEIKO EPSON CORP0 citations51
US7703894B2Apr 27, 2010
Apparatus of fabricating and method of fabricating liquid ejection head, and liquid ejection head
SEIKO EPSON CORP0 citations49