Inventor
MODER IRIS
AT24 patents
Patents
24 patentsUS10714377B2Jul 14, 2020
Semiconductor device and semiconductor wafer including a porous layer and method of manufacturing
INFINEON TECHNOLOGIES AG3 citations73
US11476111B2Oct 18, 2022
Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device
INFINEON TECHNOLOGIES AG2 citations72
US11011409B2May 18, 2021
Devices with backside metal structures and methods of formation thereof
INFINEON TECHNOLOGIES AG1 citations72
US10325804B2Jun 18, 2019
Method of wafer thinning and realizing backside metal structures
INFINEON TECHNOLOGIES AG3 citations72
US11404262B2Aug 2, 2022
Method for partially removing a semiconductor wafer
INFINEON TECHNOLOGIES AG2 citations70
US12412740B2Sep 9, 2025
Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device
INFINEON TECHNOLOGIES AG0 citations62
US11881397B2Jan 23, 2024
Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device
INFINEON TECHNOLOGIES AG0 citations62
US11342433B2May 24, 2022
Silicon carbide devices, semiconductor devices and methods for forming silicon carbide devices and semiconductor devices
INFINEON TECHNOLOGIES AG0 citations62
US12532748B2Jan 20, 2026
Semiconductor substrate having an alignment structure
INFINEON TECHNOLOGIES AG0 citations61
US9960076B2May 1, 2018
Devices with backside metal structures and methods of formation thereof
INFINEON TECHNOLOGIES AG1 citations61
US12107130B2Oct 1, 2024
Semiconductor device having semiconductor device elements in a semiconductor layer
INFINEON TECHNOLOGIES AG0 citations59
US11810779B2Nov 7, 2023
Method of porosifying part of a semiconductor wafer
INFINEON TECHNOLOGIES AG0 citations59
US11038028B2Jun 15, 2021
Semiconductor device and manufacturing method
INFINEON TECHNOLOGIES AG0 citations59
US9954065B2Apr 24, 2018
Method of forming a semiconductor device and semiconductor device
INFINEON TECHNOLOGIES AG0 citations52
US10535553B2Jan 14, 2020
Devices with backside metal structures and methods of formation thereof
INFINEON TECHNOLOGIES AG0 citations51
US10049914B2Aug 14, 2018
Method for thinning substrates
INFINEON TECHNOLOGIES AG0 citations51
US9472395B2Oct 18, 2016
Semiconductor arrangement including buried anodic oxide and manufacturing method
INFINEON TECHNOLOGIES AG1 citations51
US11373857B2Jun 28, 2022
Semiconductor surface smoothing and semiconductor arrangement
INFINEON TECHNOLOGIES AG0 citations50
US10497583B2Dec 3, 2019
Method for manufacturing a semiconductor device comprising etching a semiconductor material
INFINEON TECHNOLOGIES AG0 citations49
US10199372B2Feb 5, 2019
Monolithically integrated chip including active electrical components and passive electrical components with chip edge stabilization structures
INFINEON TECHNOLOGIES AG0 citations48
US12249504B2Mar 11, 2025
Manufacturing and reuse of semiconductor substrates
INFINEON TECHNOLOGIES AG0 citations47
US10074566B2Sep 11, 2018
Semiconductor device and methods for forming a plurality of semiconductor devices
INFINEON TECHNOLOGIES AG0 citations41
US9875926B2Jan 23, 2018
Substrates with buried isolation layers and methods of formation thereof
INFINEON TECHNOLOGIES AG0 citations41
US10802404B2Oct 13, 2020
Reticle and exposure method including projection of a reticle pattern into neighboring exposure fields
INFINEON TECHNOLOGIES AG0 citations40