Inventor

LEE MOON-CHUL

KR102 patents

⚠️ This page may combine multiple inventors who share the name “LEE MOON-CHUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE MOON-CHUL

SAMSUNG ELECTRONICS CO LTD

Method of forming a via hole through a glass wafer

Bulk acoustic wave resonator

Inductor embedded in substrate, manufacturing method thereof, micro device package, and manufacturing method of cap for micro device package

Electrostatic RF MEMS switches

Vertical MEMS gyroscope by horizontal driving

Resonator and fabricating method thereof

Ink feedhole of inkjet printhead and method of forming the same

Wafer level package for surface acoustic wave device and fabrication method thereof

Wafer level package for surface acoustic wave device and fabrication method thereof

Wafer level packaging cap and fabrication method thereof

High efficiency inductor, method for manufacturing the inductor, and packaging structure using the inductor

Packaging chip and packaging method thereof

Gyro-sensor comprising a plurality of component units, and fabricating method thereof

Inkhead printhead configured to overcome impaired print quality due to nozzle blockage, printing method using the same, and method of manufacturing the inkjet printhead

MEMS device and fabrication method thereof

Multi stack packaging chip and method of manufacturing the same

Bulk acoustic wave resonator

Radio frequency filter and manufacturing method thereof

Method of measuring biological sample properties and biological sample property measuring apparatus

Vibration type MEMS switch and fabricating method thereof

Bulk acoustic wave resonator

Inductor embedded in substrate, manufacturing method thereof, micro device package, and manufacturing method of cap for micro device package

Micro antenna and method of manufacturing the same

Thermal inkjet printhead

Bio-molecules detecting apparatus using electromagnetic induction and detecting method using the same

Wafer level packaging cap and fabrication method thereof

Cap for semiconductor device package, and manufacturing method thereof

Method for fabricating a gyroscope

MEMS device and fabrication method thereof

SAMSUNG ELECTRO MECH

Acoustic resonator and method of manufacturing the same

Bulk acoustic wave resonator and method of manufacturing the same

Resonator package and method of manufacturing the same

Bulk acoustic wave resonator

Bulk acoustic wave resonator

Acoustic resonator and method

BAW resonator and BAW filter for reducing harmonic distortion

Bulk acoustic wave resonator and method for manufacturing the same

Acoustic resonator and method of manufacturing the same

Acoustic resonator and method of manufacturing the same

Bulk-acoustic wave resonator and method for manufacturing the same

Acoustic resonator and acoustic resonator filter including the same

Acoustic resonator and method of manufacturing the same

Bulk acoustic wave resonator and method of manufacturing the same

Bulk-acoustic wave resonator

LEE MOON-CHUL

Cooler and display device having the same

SHIM DONG-SIK

Ink ejecting device and method of manufacturing the same

LEE MOON CHUL

Thin film bulk acoustic resonator and method for manufacturing same

SON SANG UK

Bulk acoustic wave resonator and manufacturing method thereof, and radio frequency device using bulk acoustic wave resonator

JEONG YONG-WON

Apparatus for and method of controlling jetting of ink in inkjet printer

LEE YONG-SOO

Display device