Inventor
LIM DONG SOON
US14 patents
⚠️ This page may combine multiple inventors who share the name “LIM DONG SOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
11 patentsUS11456284B2Sep 27, 2022
Microelectronic device assemblies and packages and related methods
MICRON TECHNOLOGY INC5 citations83
US11362070B2Jun 14, 2022
Microelectronic device assemblies and packages including multiple device stacks and related methods
MICRON TECHNOLOGY INC5 citations83
US12021668B2Jun 25, 2024
Equalization for pulse-amplitude modulation
MICRON TECHNOLOGY INC2 citations73
US11177222B2Nov 16, 2021
Semiconductor packages and associated methods with antennas and EMI isolation shields
MICRON TECHNOLOGY INC3 citations72
US12199068B2Jan 14, 2025
Methods of forming microelectronic device assemblies and packages
MICRON TECHNOLOGY INC0 citations62
US12176061B2Dec 24, 2024
Programmable memory timing
MICRON TECHNOLOGY INC0 citations62
US11961825B2Apr 16, 2024
Microelectronic device assemblies and packages including multiple device stacks and related methods
MICRON TECHNOLOGY INC0 citations62
US11948921B2Apr 2, 2024
Methods of forming stacked semiconductors die assemblies
MICRON TECHNOLOGY INC0 citations62
US11894099B2Feb 6, 2024
Programmable memory timing
MICRON TECHNOLOGY INC1 citations62
US11410973B2Aug 9, 2022
Microelectronic device assemblies and packages and related methods and systems
MICRON TECHNOLOGY INC0 citations62
US11393794B2Jul 19, 2022
Microelectronic device assemblies and packages including surface mount components
MICRON TECHNOLOGY INC0 citations62
LODESTAR LICENSING GROUP LLC
2 patentsUS12543610B2Feb 3, 2026
Microelectronic device assemblies, stacked semiconductor die assemblies, and memory device packages
LODESTAR LICENSING GROUP LLC0 citations62
US12148711B2Nov 19, 2024
Semiconductor packages and associated methods with antennas and EMI isolation shields
LODESTAR LICENSING GROUP LLC0 citations62