Inventor

FAY OWEN R

US98 patents

⚠️ This page may combine multiple inventors who share the name “FAY OWEN R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FAY OWEN R

MICRON TECHNOLOGY INC

Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods

Package-on-package semiconductor assemblies and methods of manufacturing the same

Fabricated two-sided millimeter wave antenna using through-silicon-vias

Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the same

Proximity coupling of interconnect packaging systems and methods

Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods

Microelectronic device assemblies and packages and related methods

Microelectronic device assemblies and packages including multiple device stacks and related methods

Semiconductor device assembly with pillar array

Package-on-package semiconductor assemblies and methods of manufacturing the same

Interconnect structures for preventing solder bridging, and associated systems and methods

Interconnect structures for preventing solder bridging, and associated systems and methods

Semiconductor devices with flexible reinforcement structure

Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the same

Semiconductor assemblies including thermal circuits and methods of manufacturing the same

Graphics processing unit and high bandwidth memory integration using integrated interface and silicon interposer

Graphics processing unit and high bandwidth memory integration using integrated interface and silicon interposer

Proximity coupling of interconnect packaging systems and methods

Semiconductor packages and associated methods with antennas and EMI isolation shields

Package-on-package semiconductor assemblies and methods of manufacturing the same

High density pillar interconnect conversion with stack to substrate connection

Package-on-package semiconductor assemblies and methods of manufacturing the same

Edge-notched substrate packaging and associated systems and methods

Semiconductor assemblies with redistribution structures for die stack signal routing

Semiconductor assemblies with redistribution structures for die stack signal routing

Methods and systems for manufacturing pillar structures on semiconductor devices

Semiconductor die assembly

Semiconductor device with tunable antenna using wire bonds

Semiconductor devices with flexible reinforcement structure

Three-dimensional stacking semiconductor assemblies and methods of manufacturing the same

Stacked interposer structures

Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the same

Graphics processing unit and high bandwidth memory integration using integrated interface and silicon interposer

Low cost three-dimensional stacking semiconductor assemblies

Three-dimensional stacking semiconductor assemblies with near zero bond line thickness

Semiconductor devices with flexible reinforcement structure

Semiconductor assemblies including thermal circuits and methods of manufacturing the same

Millimeter wave antenna and EMI shielding integrated with fan-out package

Integrated antenna using through silicon vias

Interposer, microelectronic device assembly including same and methods of fabrication

Low cost three-dimensional stacking semiconductor assemblies

Stacked interposer structures, microelectronic device assemblies including same, and methods of fabrication, and related electronic systems

Graphics processing unit and high bandwidth memory integration using integrated interface and silicon interposer

Proximity coupling interconnect packaging systems and methods

FREESCALE SEMICONDUCTOR INC

Method of packaging an integrated circuit die

Semiconductor device packaging

Corrosion-resistant copper bond pad and integrated device

FAY OWEN R

Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods

Pillar on pad interconnect structures, semiconductor dice and die assemblies including such interconnect structures, and related methods

FREESCALE SEMICONUCTOR INC

Die encapsulation using a porous carrier