Inventor
JUNG JAE-MIN
KR34 patents
⚠️ This page may combine multiple inventors who share the name “JUNG JAE-MIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
25 patentsUS9177904B2Nov 3, 2015
Chip-on-film package and device assembly including the same
SAMSUNG ELECTRONICS CO LTD16 citations91
US9349683B2May 24, 2016
Chip-on-film package having bending part
SAMSUNG ELECTRONICS CO LTD7 citations84
US10879208B2Dec 29, 2020
Chip-on-film and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations73
US10134667B2Nov 20, 2018
Chip-on-film semiconductor packages and display apparatus including the same
SAMSUNG ELECTRONICS CO LTD2 citations73
US9978674B2May 22, 2018
Chip-on-film semiconductor packages and display apparatus including the same
SAMSUNG ELECTRONICS CO LTD2 citations73
US10548500B2Feb 4, 2020
Apparatus for measuring bioelectrical signals
SAMSUNG ELECTRONICS CO LTD3 citations72
USD771822SNov 15, 2016
Headset for measuring brain waves
SAMSUNG ELECTRONICS CO LTD3 citations72
US11107743B2Aug 31, 2021
Chip on film package and display device including the same
SAMSUNG ELECTRONICS CO LTD3 citations71
US9280182B2Mar 8, 2016
Chip on film package and display device including the same
SAMSUNG ELECTRONICS CO LTD5 citations71
US9241407B2Jan 19, 2016
Tape film packages and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD4 citations71
US9059162B2Jun 16, 2015
Chip on film (COF) substrate, COF package and display device including the same
SAMSUNG ELECTRONICS CO LTD5 citations71
US12243798B2Mar 4, 2025
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US9305990B2Apr 5, 2016
Chip-on-film package and device assembly including the same
SAMSUNG ELECTRONICS CO LTD2 citations62
US12191246B2Jan 7, 2025
Chip-on-film package having redistribution pattern between semiconductor chip and connection terminal
SAMSUNG ELECTRONICS CO LTD0 citations61
US11830803B2Nov 28, 2023
Chip-on-film package having redistribution pattern between semiconductor chip and connection terminal
SAMSUNG ELECTRONICS CO LTD0 citations61
US11756850B2Sep 12, 2023
Chip on film package and display device including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11600556B2Mar 7, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US10840191B2Nov 17, 2020
Film package and package module including the same
SAMSUNG ELECTRONICS CO LTD1 citations55
US9362333B2Jun 7, 2016
Semiconductor packages and display devices including semiconductor packages
SAMSUNG ELECTRONICS CO LTD1 citations52
USD771260SNov 8, 2016
Headset for measuring brain waves
SAMSUNG ELECTRONICS CO LTD1 citations51
US9620389B2Apr 11, 2017
Methods of fabricating tape film packages
SAMSUNG ELECTRONICS CO LTD1 citations50
US11764140B2Sep 19, 2023
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations47
US10643948B2May 5, 2020
Film package and package module including the same
SAMSUNG ELECTRONICS CO LTD0 citations45
US9313889B2Apr 12, 2016
Display apparatus
SAMSUNG ELECTRONICS CO LTD0 citations45
US7895444B2Feb 22, 2011
Method and apparatus for preventing illegal access using prohibit key in electronic device
SAMSUNG ELECTRONICS CO LTD0 citations39