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Inventor
RIZZOLO MICHAEL R
US
2 patents
Patents
2 patents
US8027162B2
Sep 27, 2011
Liquid-cooled electronics apparatus and methods of fabrication
IBM
123 citations
97
US9685366B1
Jun 20, 2017
Forming chamferless vias using thermally decomposable porefiller
IBM
12 citations
83