Inventor

AI-CHIE WANG

SG2 patents

Patents

2 patents

US8072082B2Dec 6, 2011

Pre-encapsulated cavity interposer

YEAN TAY WUU28 citations86

US8399297B2Mar 19, 2013

Methods of forming and assembling pre-encapsulated assemblies and of forming associated semiconductor device packages

YEAN TAY WUU4 citations57