Inventor
YU HAE-JUNG
KR13 patents
⚠️ This page may combine multiple inventors who share the name “YU HAE-JUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
10 patentsUS10854551B2Dec 1, 2020
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD6 citations83
US9054228B2Jun 9, 2015
Semiconductor packages including a heat spreader and methods of forming the same
SAMSUNG ELECTRONICS CO LTD12 citations83
US8912048B2Dec 16, 2014
Method of fabricating semiconductor device including a substrate attached to a carrier
SAMSUNG ELECTRONICS CO LTD8 citations83
US11282792B2Mar 22, 2022
Semiconductor package having dummy pads and method of manufacturing semiconductor package having dummy pads
SAMSUNG ELECTRONICS CO LTD2 citations73
US12218070B2Feb 4, 2025
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11637070B2Apr 25, 2023
Method of fabricating a semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US12080676B2Sep 3, 2024
Semiconductor package including a molding layer
SAMSUNG ELECTRONICS CO LTD0 citations61
US7923291B2Apr 12, 2011
Method of fabricating electronic device having stacked chips
SAMSUNG ELECTRONICS CO LTD0 citations51
US9245863B2Jan 26, 2016
Semiconductor packaging apparatus formed from semiconductor package including first and second solder balls having different heights
SAMSUNG ELECTRONICS CO LTD1 citations49
US11935867B2Mar 19, 2024
Semiconductor package with memory stack structure connected to logic dies via an interposer
SAMSUNG ELECTRONICS CO LTD0 citations48
YIM CHOONGBIN
2 patentsUS8779606B2Jul 15, 2014
Package-on-package electronic devices including sealing layers and related methods of forming the same
YIM CHOONGBIN55 citations95
US9245867B2Jan 26, 2016
Package-on-package electronic devices including sealing layers and related methods of forming the same
YIM CHOONGBIN4 citations71