Inventor

HSAIO CHING-WEN

TW2 patents

Patents

2 patents

US9059181B2Jun 16, 2015

Wafer leveled chip packaging structure and method thereof

INVENSAS CORP2 citations60

US9601474B2Mar 21, 2017

Electrically stackable semiconductor wafer and chip packages

INVENSAS CORP0 citations39