Inventor
LIN CHEN-HAO
TW10 patents
Patents
10 patentsUS11445617B2Sep 13, 2022
Package structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP2 citations72
US12414243B2Sep 9, 2025
Manufacturing method of package structure
UNIMICRON TECHNOLOGY CORP0 citations62
US11943877B2Mar 26, 2024
Circuit board structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP1 citations62
US12504591B2Dec 23, 2025
Co-packaged structure for optics and electrics
UNIMICRON TECHNOLOGY CORP0 citations61
US11523503B2Dec 6, 2022
Wiring board and method of forming hole thereof
UNIMICRON TECHNOLOGY CORP0 citations60
US10993332B2Apr 27, 2021
Circuit substrate
UNIMICRON TECHNOLOGY CORP1 citations60
US11219130B2Jan 4, 2022
Circuit board and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations50
US11166387B2Nov 2, 2021
Wiring board and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations50
US11895780B2Feb 6, 2024
Manufacturing method of package structure
UNIMICRON TECHNOLOGY CORP0 citations49
US11682658B2Jun 20, 2023
Light-emitting package and method of manufacturing the same
UNIMICRON TECHNOLOGY CORP0 citations46