Inventor

LAU JOHN HON-SHING

HK19 patents

⚠️ This page may combine multiple inventors who share the name “LAU JOHN HON-SHING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LAU JOHN HON-SHING

UNIMICRON TECHNOLOGY CORP

Circuit carrier and manufacturing method thereof and package structure

Circuit board structure and manufacturing method thereof

Package structure and manufacturing method thereof

Probe card testing device

Package structure and manufacturing method thereof

Manufacturing method of package structure

Circuit substrate structure and manufacturing method thereof

Integrated circuit package structure

Manufacturing method of the chip package structure having at least one chip and at least one thermally conductive element

Chip package structure having at least one chip and at least one thermally conductive element and manufacturing method thereof

Package structure and manufacturing method thereof

Package structure and optical signal transmitter

Package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Circuit board structure and manufacturing method thereof

Circuit board structure and manufacturing method thereof

HU DYI-CHUNG

Packaging substrate having embedded interposer and fabrication method thereof

UNIMICRON TECH CORPORATION

Integrated circuit package structure and method of manufacturing the same

ASM TECH SINGAPORE PTE LTD

Thermally-enhanced provision of underfill to electronic devices using a stencil