Inventor

CHEN YU-HUA

TW65 patents

⚠️ This page may combine multiple inventors who share the name “CHEN YU-HUA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEN YU-HUA

UNIMICRON TECHNOLOGY CORP

Package structure with structure reinforcing element and manufacturing method thereof

Package structure and manufacturing method thereof

Light-emitting diode package and manufacturing method thereof

Package carrier and manufacturing method thereof

Manufacturing method of interconnection structure

Circuit board element

Interconnection structure and manufacturing method thereof

Circuit board and method of manufacturing the same

Method for manufacturing an interposer, interposer and chip package structure

Manufacturing method of package structure

Manufacturing method of package carrier

Package structure with structure reinforcing element and manufacturing method thereof

Package structure with structure reinforcing element and manufacturing method thereof

Package substrate structure and bonding method thereof

Manufacturing method of substrate structure

Mask structure and manufacturing method thereof

Circuit board structure and fabrication method thereof

Circuit board structure and manufacturing method thereof

Circuit board structure and manufacturing method thereof

Package structure and bonding method thereof

Stacked structure and method for manufacturing the same

Method for manufacturing circuit redistribution structure

Circuit redistribution structure unit and method for manufacturing circuit redistribution structure

Substrate structure and manufacturing method thereof

Package carrier structure having integrated circuit design and manufacturing method thereof

IND TECH RES INST

Wafer-leveled chip packaging structure and method thereof

Self-assembled nanometer conductive bumps and method for fabricating

Wafer-leveled chip packaging structure and method thereof

Method of migrating and fixing particles in a solution to bumps on a chip

Package substrate having photo-sensitive dielectric layer and method of fabricating the same

Package substrate and method of fabricating the same

Package substrate and method of fabricating the same and chip package structure

Electronic device package and method of manufacturing the same

Package substrate and method of fabricating the same

Flexible light source device and fabrication method thereof

Electronic device package and method of manufacturing the same

CHEN YU-HUA

Anti-mildew and antiseptic sticker

Flexible circuit structure with stretchability and method of manufacturing the same

CHEN SHOU-LUNG

Semiconductor package device

Wafer-leveled chip packaging structure and method thereof

TAOGLAS GROUP HOLDINGS LTD

Antenna box module and antenna box

Antenna module and antenna housing

KO CHENG-TA

Structure of multiple coaxial leads within single via in substrate and manufacturing method thereof

HSU CHAO-KAI

Plane light source and flexible plane light source

LEE YUAN-CHANG

Flexible circuit structure

CHEN JUI-HSIANG

Brush polymer and medical use thereof

GOGORO INC

Bicycle stem

CHEN YU HUA

Burglar alarm including a reed relay actuated in response to a vibrating magnet to produce an alarm signal

INVENSAS CORP

Wafer leveled chip packaging structure and method thereof

IND TECHNOLOGY RES INSTITTUTE

Biodegradable hyaluronic acid derivative and biodegradable polymeric micelle composition