Inventor
SURTHI SHYAM
US72 patents
⚠️ This page may combine multiple inventors who share the name “SURTHI SHYAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
38 patentsUS7557013B2Jul 7, 2009
Methods of forming a plurality of capacitors
MICRON TECHNOLOGY INC70 citations97
US10777576B1Sep 15, 2020
Integrated assemblies having charge-trapping material arranged in vertically-spaced segments, and methods of forming integrated assemblies
MICRON TECHNOLOGY INC12 citations85
US9559201B2Jan 31, 2017
Vertical memory devices, memory arrays, and memory devices
MICRON TECHNOLOGY INC10 citations84
US8609488B2Dec 17, 2013
Methods of forming a vertical transistor and at least a conductive line electrically coupled therewith
MICRON TECHNOLOGY INC5 citations84
US7928019B2Apr 19, 2011
Semiconductor processing
MICRON TECHNOLOGY INC8 citations84
US11037956B2Jun 15, 2021
Integrated assemblies having charge-trapping material arranged in vertically-spaced segments, and methods of forming integrated assemblies
MICRON TECHNOLOGY INC4 citations83
US11171153B2Nov 9, 2021
Integrated assemblies having improved charge migration
MICRON TECHNOLOGY INC2 citations73
US11081497B2Aug 3, 2021
Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies
MICRON TECHNOLOGY INC4 citations73
US10923480B2Feb 16, 2021
Capacitance reduction in a semiconductor device
MICRON TECHNOLOGY INC2 citations73
US9230968B2Jan 5, 2016
Methods of forming memory arrays and semiconductor constructions
MICRON TECHNOLOGY INC3 citations73
US11672118B2Jun 6, 2023
Electronic devices comprising adjoining oxide materials and related systems
MICRON TECHNOLOGY INC2 citations72
US11107830B2Aug 31, 2021
Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies
MICRON TECHNOLOGY INC3 citations72
US11244954B2Feb 8, 2022
Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies
MICRON TECHNOLOGY INC2 citations71
US11672120B2Jun 6, 2023
Integrated assemblies having charge-trapping material arranged in vertically-spaced segments, and methods of forming integrated assemblies
MICRON TECHNOLOGY INC2 citations69
US11605645B2Mar 14, 2023
Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies
MICRON TECHNOLOGY INC0 citations63
US11417682B2Aug 16, 2022
Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies
MICRON TECHNOLOGY INC0 citations63
US11031414B2Jun 8, 2021
Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies
MICRON TECHNOLOGY INC1 citations63
US11024644B2Jun 1, 2021
Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies
MICRON TECHNOLOGY INC0 citations63
US9111853B2Aug 18, 2015
Methods of forming doped elements of semiconductor device structures
MICRON TECHNOLOGY INC2 citations63
US8007275B2Aug 30, 2011
Methods and apparatuses for heating semiconductor wafers
MICRON TECHNOLOGY INC2 citations63
US7858535B2Dec 28, 2010
Methods of reducing defect formation on silicon dioxide formed by atomic layer deposition (ALD) processes and methods of fabricating semiconductor structures
MICRON TECHNOLOGY INC3 citations63
US12557289B2Feb 17, 2026
Electronic devices comprising adjoining oxide materials and related systems
MICRON TECHNOLOGY INC0 citations62
US12057400B2Aug 6, 2024
Integrated assemblies and methods of forming integrated assemblies
MICRON TECHNOLOGY INC0 citations62
US12052862B2Jul 30, 2024
Microelectronic devices including stack structures having air gaps, and related memory devices, electronic systems, and methods
MICRON TECHNOLOGY INC0 citations62
US12041779B2Jul 16, 2024
Integrated assemblies and methods of forming integrated assemblies
MICRON TECHNOLOGY INC0 citations62
US11729982B2Aug 15, 2023
Integrated assemblies and methods of forming integrated assemblies
MICRON TECHNOLOGY INC0 citations62
US11631697B2Apr 18, 2023
Integrated assemblies having vertically-extending channel material with alternating regions of different dopant distributions, and methods of forming integrated assemblies
MICRON TECHNOLOGY INC0 citations62
US11587948B2Feb 21, 2023
Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies
MICRON TECHNOLOGY INC0 citations62
US11563031B2Jan 24, 2023
Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies
MICRON TECHNOLOGY INC0 citations62
US11557608B2Jan 17, 2023
Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies
MICRON TECHNOLOGY INC0 citations62
US11296103B2Apr 5, 2022
Integrated assemblies and methods of forming integrated assemblies
MICRON TECHNOLOGY INC0 citations62
US11289501B2Mar 29, 2022
Integrated assemblies having vertically-extending channel material with alternating regions of different dopant distributions, and methods of forming integrated assemblies
MICRON TECHNOLOGY INC0 citations62
US11189629B2Nov 30, 2021
Integrated assemblies and methods of forming integrated assemblies
MICRON TECHNOLOGY INC0 citations62
US11081498B2Aug 3, 2021
Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies
MICRON TECHNOLOGY INC0 citations62
US10930652B2Feb 23, 2021
Apparatuses including buried digit lines
MICRON TECHNOLOGY INC0 citations62
US9318493B2Apr 19, 2016
Memory arrays, semiconductor constructions, and methods of forming semiconductor constructions
MICRON TECHNOLOGY INC1 citations62
US8871589B2Oct 28, 2014
Methods of forming semiconductor constructions
MICRON TECHNOLOGY INC1 citations62
US8790977B2Jul 29, 2014
Methods of forming a vertical transistor, methods of forming memory cells, and methods of forming arrays of memory cells
MICRON TECHNOLOGY INC2 citations62
LODESTAR LICENSING GROUP LLC
3 patentsUS12185544B2Dec 31, 2024
Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies
LODESTAR LICENSING GROUP LLC0 citations63
US12156406B2Nov 26, 2024
Methods of forming integrated assemblies with improved charge migration impedance
LODESTAR LICENSING GROUP LLC0 citations62
US12150303B2Nov 19, 2024
Integrated assemblies having charge-trapping material arranged in vertically-spaced segments, and methods of forming integrated assemblies
LODESTAR LICENSING GROUP LLC0 citations62
NANYA TECHNOLOGY CORP
2 patentsGUHA JAYDIP
2 patentsHEINECK LARS P
1 patentBOCIAN DAVID F
1 patentUNIV CALIFORNIA
1 patentSURTHI SHYAM
1 patentSMYTHE JOHN A
1 patentShowing the top 50 of 72 patents by PatentIndex Score.