Inventor
HSEIH BIAY-CHENG
US24 patents
⚠️ This page may combine multiple inventors who share the name “HSEIH BIAY-CHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QUALCOMM INC
16 patentsUS9332200B1May 3, 2016
Pixel readout architecture for full well capacity extension
QUALCOMM INC70 citations98
US9774801B2Sep 26, 2017
Solid state image sensor with enhanced charge capacity and dynamic range
QUALCOMM INC27 citations94
US9560296B2Jan 31, 2017
Pixel readout architecture for full well capacity extension
QUALCOMM INC15 citations92
US9698191B2Jul 4, 2017
System and method to extend near infrared spectral response for imaging systems
QUALCOMM INC8 citations84
US9692997B2Jun 27, 2017
Pixel readout architecture for full well capacity extension
QUALCOMM INC7 citations84
US9986223B2May 29, 2018
Folded optic passive depth sensing system
QUALCOMM INC5 citations71
US11561085B2Jan 24, 2023
Resolving multipath interference using a mixed active depth system
QUALCOMM INC1 citations62
US11563873B2Jan 24, 2023
Wide-angle 3D sensing
QUALCOMM INC0 citations62
US11488999B2Nov 1, 2022
Active depth sensing image sensor
QUALCOMM INC0 citations62
US11037966B2Jun 15, 2021
Solid state image sensor with on-chip filter and extended spectral response
QUALCOMM INC0 citations62
US11818462B2Nov 14, 2023
Phase detection autofocus sensor apparatus and method for depth sensing
QUALCOMM INC0 citations52
US11763425B2Sep 19, 2023
High resolution time-of-flight depth imaging
QUALCOMM INC0 citations52
US11438486B2Sep 6, 2022
3D active depth sensing with laser pulse train bursts and a gated sensor
QUALCOMM INC0 citations52
US10608036B2Mar 31, 2020
Metal mesh light pipe for transporting light in an image sensor
QUALCOMM INC0 citations52
US11297258B2Apr 5, 2022
High dynamic range solid state image sensor and camera system
QUALCOMM INC0 citations51
US9786705B2Oct 10, 2017
Solid state image sensor with extended spectral response
QUALCOMM INC0 citations41