Inventor
BOWEN NEAL
US3 patents
Patents
3 patentsUS9716023B2Jul 25, 2017
Methods for temporarily bonding a device wafer to a carrier wafer, and related assemblies
MICRON TECHNOLOGY INC4 citations70
US7372129B2May 13, 2008
Two die semiconductor assembly and system including same
MICRON TECHNOLOGY INC5 citations56
US7368320B2May 6, 2008
Method of fabricating a two die semiconductor assembly
MICRON TECHNOLOGY INC4 citations56