Inventor

WRSCHKA PETER

US11 patents

⚠️ This page may combine multiple inventors who share the name “WRSCHKA PETER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

2 patents

US6570256B2May 27, 2003

Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates

IBM85 citations96

US6740539B2May 25, 2004

Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates

IBM37 citations91

ADVANCED TECH MATERIALS

2 patents

US7300601B2Nov 27, 2007

Passivative chemical mechanical polishing composition for copper film planarization

ADVANCED TECH MATERIALS45 citations94

US7736405B2Jun 15, 2010

Chemical mechanical polishing compositions for copper and associated materials and method of using same

ADVANCED TECH MATERIALS28 citations90

INFINEON TECHNOLOGIES AG

2 patents

US6899597B2May 31, 2005

Chemical mechanical polishing (CMP) process using fixed abrasive pads

INFINEON TECHNOLOGIES AG2 citations62

US6943114B2Sep 13, 2005

Integration scheme for metal gap fill, with fixed abrasive CMP

INFINEON TECHNOLOGIES AG0 citations51

LURCOTT STEVEN M

1 patent

US9038855B2May 26, 2015

Fluid processing systems and methods

LURCOTT STEVEN M48 citations94

BOGGS KARL E

1 patent

US8304344B2Nov 6, 2012

High throughput chemical mechanical polishing composition for metal film planarization

BOGGS KARL E26 citations88

LIU JUN

1 patent

US8236695B2Aug 7, 2012

Method of passivating chemical mechanical polishing compositions for copper film planarization processes

LIU JUN11 citations84

HUGHES JOHN E Q

1 patent

US8507382B2Aug 13, 2013

Systems and methods for delivery of fluid-containing process material combinations

HUGHES JOHN E Q8 citations81

ENTEGRIS INC

1 patent

US9586188B2Mar 7, 2017

Fluid processing systems and methods

ENTEGRIS INC2 citations72