Inventor
ISHIKAWA YOSHIO
US22 patents
⚠️ This page may combine multiple inventors who share the name “ISHIKAWA YOSHIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOKYO ELECTRON LTD
10 patentsUS5556500ASep 17, 1996
Plasma etching apparatus
TOKYO ELECTRON LTD191 citations97
US5240556AAug 31, 1993
Surface-heating apparatus and surface-treating method
TOKYO ELECTRON LTD75 citations96
US5259923ANov 9, 1993
Dry etching method
TOKYO ELECTRON LTD61 citations95
US5772833AJun 30, 1998
Plasma etching apparatus
TOKYO ELECTRON LTD57 citations94
US5271788ADec 21, 1993
Plasma processing apparatus
TOKYO ELECTRON LTD38 citations92
US5164034ANov 17, 1992
Apparatus and method for processing substrate
TOKYO ELECTRON LTD15 citations74
US5368684ANov 29, 1994
Etching method for a silicon-containing layer using hydrogen bromide
TOKYO ELECTRON LTD11 citations69
US10818502B2Oct 27, 2020
System and method of plasma discharge ignition to reduce surface particles
TOKYO ELECTRON LTD1 citations61
US10950452B2Mar 16, 2021
Seasoning method and etching method
TOKYO ELECTRON LTD0 citations52
US9530626B2Dec 27, 2016
Method and apparatus for ESC charge control for wafer clamping
TOKYO ELECTRON LTD0 citations48
OTSUKA KAGAKU KK
3 patentsUS5601886AFeb 11, 1997
Artificial turf
OTSUKA KAGAKU KK74 citations95
US6219965B1Apr 24, 2001
Plant growth sheet structure, natural turf sheet structure, method of growing turf and method of laying turf sheet structure
OTSUKA KAGAKU KK73 citations93
US5462778AOct 31, 1995
Artificial turf, pile yarn for artificial turf and process and spinneret for producing pile yarn
OTSUKA KAGAKU KK30 citations92
APPLIED MATERIALS INC
3 patentsUS6461533B1Oct 8, 2002
Etchant for silicon oxide and method
APPLIED MATERIALS INC20 citations92
US6432318B1Aug 13, 2002
Dielectric etch process reducing striations and maintaining critical dimensions
APPLIED MATERIALS INC24 citations92
US7253115B2Aug 7, 2007
Dual damascene etch processes
APPLIED MATERIALS INC10 citations80