Inventor

MANDALAPU CHANDRA SEKHAR

US2 patents

Patents

2 patents

US12525573B2Jan 13, 2026

Partitioning wafer processing and hybrid bonding of layers formed on different wafers for a semiconductor assembly

ADVANCED MICRO DEVICES INC0 citations56

US12519085B2Jan 6, 2026

Direct cooling for SoIC architectures

ADVANCED MICRO DEVICES INC0 citations55