Inventor
WU MING-CHIA
TW20 patents
⚠️ This page may combine multiple inventors who share the name “WU MING-CHIA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CYNTEC CO LTD
8 patentsUS9984996B2May 29, 2018
Three-dimensional (3D) package structure with electronic components encapsulated by a connection structure over an inductor
CYNTEC CO LTD20 citations93
US10297573B2May 21, 2019
Three-dimensional package structure and the method to fabricate thereof
CYNTEC CO LTD1 citations72
US11067606B2Jul 20, 2021
Current sensing module
CYNTEC CO LTD3 citations64
US10529680B2Jan 7, 2020
Encapsulated electronic device mounted on a redistribution layer
CYNTEC CO LTD1 citations62
US9911715B2Mar 6, 2018
Three-dimensional package structure and the method to fabricate thereof
CYNTEC CO LTD1 citations62
US9859250B2Jan 2, 2018
Substrate and the method to fabricate thereof
CYNTEC CO LTD1 citations62
US10854575B2Dec 1, 2020
Three-dimensional (3D) package structure having an epoxy molding compound layer between a discrete inductor and an encapsulating connecting structure
CYNTEC CO LTD0 citations51
US10128214B2Nov 13, 2018
Substrate and the method to fabricate thereof
CYNTEC CO LTD0 citations51
DELTA ELECTRONICS INC
4 patentsUS7448899B2Nov 11, 2008
Connecting module for communication
DELTA ELECTRONICS INC12 citations79
US11098738B2Aug 24, 2021
Transceiver module
DELTA ELECTRONICS INC4 citations68
US7397643B2Jul 8, 2008
Protection circuit
DELTA ELECTRONICS INC0 citations51
US7597487B2Oct 6, 2009
Optical communication device
DELTA ELECTRONICS INC1 citations49
OPVISTA INC
3 patentsUS6525857B1Feb 25, 2003
Method and apparatus for interleaved optical single sideband modulation
OPVISTA INC132 citations98
US7206520B2Apr 17, 2007
Method and apparatus for interleaved optical single sideband modulation
OPVISTA INC42 citations94
US7003231B2Feb 21, 2006
Method and apparatus for interleaved optical single sideband modulation
OPVISTA INC47 citations94