Inventor
LU SHAO WEI
TW22 patents
⚠️ This page may combine multiple inventors who share the name “LU SHAO WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CYNTEC CO LTD
6 patentsUS9984996B2May 29, 2018
Three-dimensional (3D) package structure with electronic components encapsulated by a connection structure over an inductor
CYNTEC CO LTD20 citations93
US10297573B2May 21, 2019
Three-dimensional package structure and the method to fabricate thereof
CYNTEC CO LTD1 citations72
US9911715B2Mar 6, 2018
Three-dimensional package structure and the method to fabricate thereof
CYNTEC CO LTD1 citations62
US9859250B2Jan 2, 2018
Substrate and the method to fabricate thereof
CYNTEC CO LTD1 citations62
US10854575B2Dec 1, 2020
Three-dimensional (3D) package structure having an epoxy molding compound layer between a discrete inductor and an encapsulating connecting structure
CYNTEC CO LTD0 citations51
US10128214B2Nov 13, 2018
Substrate and the method to fabricate thereof
CYNTEC CO LTD0 citations51
MPI CORP
6 patentsUS9645197B2May 9, 2017
Method of operating testing system
MPI CORP0 citations50
US9459279B2Oct 4, 2016
Electrical testing machine
MPI CORP1 citations47
US9880252B2Jan 30, 2018
Method of calibrating and debugging testing system
MPI CORP0 citations39
US9759743B2Sep 12, 2017
Testing system and method for testing of electrical connections
MPI CORP0 citations39
US9581676B2Feb 28, 2017
Method of calibrating and debugging testing system
MPI CORP0 citations39
US9523708B2Dec 20, 2016
Electrical testing device
MPI CORP0 citations36
KU CHEN-WEI
3 patentsUS8418853B2Apr 16, 2013
Reticle POD with sensor
KU CHEN-WEI8 citations83
US8413814B2Apr 9, 2013
Front opening unified pod disposed with purgeable supporting module
KU CHEN-WEI5 citations71
US8413815B2Apr 9, 2013
Wafer container with at least one purgeable supporting module having a long slot
KU CHEN-WEI4 citations61