Inventor
WOO KWANGBOK
KR2 patents
Patents
2 patentsUS11749592B2Sep 5, 2023
Package-on-package type semiconductor package including a lower semiconductor package and an upper semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations53
US12406917B2Sep 2, 2025
Semiconductor package and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations45