Inventor
HIRAO HIROHIKO
JP15 patents
⚠️ This page may combine multiple inventors who share the name “HIRAO HIROHIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHIKOKU CHEM
12 patentsUS5795409AAug 18, 1998
Surface treating agent for copper or copper alloy
SHIKOKU CHEM37 citations90
US5560785AOct 1, 1996
Method for forming a protective chemical layer on copper and copper alloy surfaces
SHIKOKU CHEM31 citations90
US5498301AMar 12, 1996
Agent for treating surfaces of copper and copper alloys
SHIKOKU CHEM38 citations90
US7754105B2Jul 13, 2010
Water-soluble preflux and usage of the same
SHIKOKU CHEM3 citations61
US12091430B2Sep 17, 2024
Metal surface treatment liquid and liquid concentrate thereof, metal surface treatment liquid set, metal surface treatment method, and method for manufacturing printed wiring board
SHIKOKU CHEM0 citations60
US11680076B2Jun 20, 2023
Triazole silane compound, method for synthesizing said compound and use thereof
SHIKOKU CHEM0 citations57
US11472823B2Oct 18, 2022
Tetrazole silane compound, method for synthesizing said compound and use thereof
SHIKOKU CHEM0 citations56
US11014946B2May 25, 2021
Tetrazole silane compound, method for synthesizing said compound and use thereof
SHIKOKU CHEM1 citations56
US10398028B2Aug 27, 2019
Surface treating composition for copper and copper alloy and utilization thereof
SHIKOKU CHEM0 citations51
US8378116B2Feb 19, 2013
Phenylnaphthylimidazole compound and usage of the same
SHIKOKU CHEM0 citations51
US7661577B2Feb 16, 2010
Imidazole compound and use thereof
SHIKOKU CHEM0 citations40
US10405422B2Sep 3, 2019
Copper film-forming agent and method for forming copper film
SHIKOKU CHEM0 citations38
HIRAO HIROHIKO
3 patentsUS8183386B2May 22, 2012
Phenylnaphthylimidazole compound and usage of the same
HIRAO HIROHIKO1 citations58
US9532493B2Dec 27, 2016
Surface treating composition for copper and copper alloy and utilization thereof
HIRAO HIROHIKO0 citations48
US9649713B2May 16, 2017
Surface treating composition for copper and copper alloy and utilization thereof
HIRAO HIROHIKO0 citations37