Inventor
REID JONATHAN DAVID
US20 patents
⚠️ This page may combine multiple inventors who share the name “REID JONATHAN DAVID”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NOVELLUS SYSTEMS INC
10 patentsUS6179983B1Jan 30, 2001
Method and apparatus for treating surface including virtual anode
NOVELLUS SYSTEMS INC341 citations98
US6126798AOct 3, 2000
Electroplating anode including membrane partition system and method of preventing passivation of same
NOVELLUS SYSTEMS INC259 citations98
US6653226B1Nov 25, 2003
Method for electrochemical planarization of metal surfaces
NOVELLUS SYSTEMS INC76 citations97
US6569299B1May 27, 2003
Membrane partition system for plating of wafers
NOVELLUS SYSTEMS INC101 citations97
US6458262B1Oct 1, 2002
Electroplating chemistry on-line monitoring and control system
NOVELLUS SYSTEMS INC79 citations97
US6284121B1Sep 4, 2001
Electroplating system including additive for filling sub-micron features
NOVELLUS SYSTEMS INC53 citations96
US6024857AFeb 15, 2000
Electroplating additive for filling sub-micron features
NOVELLUS SYSTEMS INC73 citations96
US6554914B1Apr 29, 2003
Passivation of copper in dual damascene metalization
NOVELLUS SYSTEMS INC62 citations95
US10472730B2Nov 12, 2019
Electrolyte concentration control system for high rate electroplating
NOVELLUS SYSTEMS INC2 citations73
US10745817B2Aug 18, 2020
Configuration and method of operation of an electrodeposition system for improved process stability and performance
NOVELLUS SYSTEMS INC0 citations51
LAM RES CORP
8 patentsUS9481942B2Nov 1, 2016
Geometry and process optimization for ultra-high RPM plating
LAM RES CORP9 citations83
US10329683B2Jun 25, 2019
Process for optimizing cobalt electrofill using sacrificial oxidants
LAM RES CORP2 citations68
US9777386B2Oct 3, 2017
Chemistry additives and process for cobalt film electrodeposition
LAM RES CORP5 citations68
US11208732B2Dec 28, 2021
Monitoring surface oxide on seed layers during electroplating
LAM RES CORP0 citations58
US10443146B2Oct 15, 2019
Monitoring surface oxide on seed layers during electroplating
LAM RES CORP1 citations58
US11078591B2Aug 3, 2021
Process for optimizing cobalt electrofill using sacrificial oxidants
LAM RES CORP0 citations57
US10358738B2Jul 23, 2019
Gap fill process stability monitoring of an electroplating process using a potential-controlled exit step
LAM RES CORP0 citations51
US12012667B2Jun 18, 2024
Copper electrofill on non-copper liner layers
LAM RES CORP0 citations49