Inventor
RANJAN MANISH
US21 patents
⚠️ This page may combine multiple inventors who share the name “RANJAN MANISH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
9 patentsUS9735035B1Aug 15, 2017
Methods and apparatuses for estimating on-wafer oxide layer reduction effectiveness via color sensing
LAM RES CORP7 citations83
US10593586B2Mar 17, 2020
Systems and methods for controlling substrate approach toward a target horizontal plane
LAM RES CORP2 citations71
US10497592B2Dec 3, 2019
Methods and apparatuses for estimating on-wafer oxide layer reduction effectiveness via color sensing
LAM RES CORP1 citations61
US11621187B2Apr 4, 2023
Systems and methods for controlling substrate approach toward a target horizontal plane
LAM RES CORP0 citations60
US11208732B2Dec 28, 2021
Monitoring surface oxide on seed layers during electroplating
LAM RES CORP0 citations58
US10443146B2Oct 15, 2019
Monitoring surface oxide on seed layers during electroplating
LAM RES CORP1 citations58
US12105039B2Oct 1, 2024
Systems and methods for in-situ measurement of sheet resistance on substrates
LAM RES CORP0 citations53
US12532718B2Jan 20, 2026
Improving substrate wettability for plating operations
LAM RES CORP0 citations49
US12180607B2Dec 31, 2024
Electrochemical deposition system including optical probes
LAM RES CORP0 citations43
ASML NETHERLANDS BV
4 patentsUS12158706B2Dec 3, 2024
Lithographic apparatus and method with improved contaminant particle capture
ASML NETHERLANDS BV2 citations73
US9625835B2Apr 18, 2017
Lithographic apparatus and device manufacturing method
ASML NETHERLANDS BV2 citations69
US11906907B2Feb 20, 2024
Apparatus and method for determining a condition associated with a pellicle
ASML NETHERLANDS BV0 citations59
US9823590B2Nov 21, 2017
Lithographic apparatus and device manufacturing method
ASML NETHERLANDS BV0 citations48
NOVELLUS SYSTEMS INC
2 patentsUS9587322B2Mar 7, 2017
Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath
NOVELLUS SYSTEMS INC6 citations83
US10968531B2Apr 6, 2021
Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath
NOVELLUS SYSTEMS INC1 citations72