Inventor
YANG TSUNG-HAN
TW41 patents
⚠️ This page may combine multiple inventors who share the name “YANG TSUNG-HAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ACER INC
10 patentsUS10373399B2Aug 6, 2019
Photographing system for long-distance running event and operation method thereof
ACER INC2 citations73
US10696224B2Jun 30, 2020
Driving notification method and driving notification system
ACER INC3 citations70
US11288307B2Mar 29, 2022
Method, electronic device, and computer readable medium for photo organization
ACER INC0 citations62
US11034294B2Jun 15, 2021
Driving notification method and driving notification system
ACER INC0 citations59
US10506284B2Dec 10, 2019
Visual utility analytic method and related eye tracking device and system
ACER INC1 citations59
US11955245B2Apr 9, 2024
Method and system for mental index prediction
ACER INC0 citations58
US11176684B2Nov 16, 2021
Customer behavior analyzing method and customer behavior analyzing system
ACER INC1 citations56
US10459966B2Oct 29, 2019
Method, electronic device, and computer readable medium for photo organization
ACER INC0 citations52
US10977340B2Apr 13, 2021
Dynamic grayscale adjustment method and related device
ACER INC0 citations49
US10535284B2Jan 14, 2020
Visual range mapping method and related eye tracking device and system
ACER INC0 citations49
LAM RES CORP
6 patentsUS10211099B2Feb 19, 2019
Chamber conditioning for remote plasma process
LAM RES CORP24 citations92
US11978666B2May 7, 2024
Void free low stress fill
LAM RES CORP4 citations75
US12261081B2Mar 25, 2025
Tungsten feature fill with inhibition control
LAM RES CORP2 citations73
US12173399B2Dec 24, 2024
Reducing line bending during metal fill process
LAM RES CORP1 citations62
US12476143B2Nov 18, 2025
Backside reactive inhibition gas
LAM RES CORP0 citations61
US12002679B2Jun 4, 2024
High step coverage tungsten deposition
LAM RES CORP1 citations61
APPLIED MATERIALS INC
6 patentsUS12272531B2Apr 8, 2025
Dual pressure oxidation method for forming an oxide layer in a feature
APPLIED MATERIALS INC0 citations62
US12473643B2Nov 18, 2025
Low resistivity gapfill for logic devices
APPLIED MATERIALS INC0 citations61
US12341032B2Jun 24, 2025
Methods of selective oxidation on rapid thermal processing (RTP) chamber with active steam generation
APPLIED MATERIALS INC0 citations56
US11996305B2May 28, 2024
Selective oxidation on rapid thermal processing (RTP) chamber with active steam generation
APPLIED MATERIALS INC0 citations56
US11761080B2Sep 19, 2023
Method for processing a substrate by oscillating a boundary layer of the flow of one or more process gases over a surface of a substrate and systems for processing a substrate using the method
APPLIED MATERIALS INC0 citations52
US12394619B2Aug 19, 2025
Metal oxide preclean for bottom-up gapfill in MEOL and BEOL
APPLIED MATERIALS INC0 citations48
NOVELLUS SYSTEMS INC
4 patentsUS9034760B2May 19, 2015
Methods of forming tensile tungsten films and compressive tungsten films
NOVELLUS SYSTEMS INC25 citations92
US11437269B2Sep 6, 2022
Tungsten feature fill with nucleation inhibition
NOVELLUS SYSTEMS INC8 citations84
US10381266B2Aug 13, 2019
Tungsten feature fill with nucleation inhibition
NOVELLUS SYSTEMS INC7 citations82
US12387979B2Aug 12, 2025
Tungsten feature fill with nucleation inhibition
NOVELLUS SYSTEMS INC0 citations61
AUDIOWISE TECH INC
3 patentsUS11727865B1Aug 15, 2023
Light-emitting diode driver and display apparatus using the same
AUDIOWISE TECH INC1 citations58
US11327598B1May 10, 2022
Touch detection circuit chip with reduced power consumption
AUDIOWISE TECH INC0 citations58
US11257809B2Feb 22, 2022
Electrostatic discharge circuit and method for preventing malfunctioning of integrated circuit from reverse connection of power source
AUDIOWISE TECH INC0 citations49