Inventor
HSIEH YUN CHEN
TW21 patents
Patents
21 patentsUS10361122B1Jul 23, 2019
Processes for reducing leakage and improving adhesion
TAIWAN SEMICONDUCTOR MFG CO LTD14 citations94
US11651994B2May 16, 2023
Processes for reducing leakage and improving adhesion
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations86
US10964591B2Mar 30, 2021
Processes for reducing leakage and improving adhesion
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US10515848B1Dec 24, 2019
Semiconductor package and method
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US11404308B2Aug 2, 2022
Semiconductor package and method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10971442B2Apr 6, 2021
Semiconductor device having via sidewall adhesion with encapsulant
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10840129B2Nov 17, 2020
Semiconductor package and method
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11587902B2Feb 21, 2023
Semiconductor structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US10522501B2Dec 31, 2019
Semiconductor structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10186462B2Jan 22, 2019
Semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US12315819B2May 27, 2025
Method of forming RDLs and structure formed thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12062603B2Aug 13, 2024
Semiconductor device having via sidewall adhesion with encapsulant
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12020983B2Jun 25, 2024
Processes for reducing leakage and improving adhesion
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11742317B2Aug 29, 2023
Process including a re-etching process for forming a semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11600574B2Mar 7, 2023
Method of forming RDLS and structure formed thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11527466B2Dec 13, 2022
Semiconductor device having via sidewall adhesion with encapsulant
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10892228B2Jan 12, 2021
Method of manufacturing conductive feature and method of manufacturing package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10886231B2Jan 5, 2021
Method of forming RDLS and structure formed thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10867874B2Dec 15, 2020
Semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US10297551B2May 21, 2019
Method of manufacturing redistribution circuit structure and method of manufacturing integrated fan-out package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12381176B2Aug 5, 2025
Semiconductor structure having a conductive feature comprising an adhesion layer and a metal region over and contacting the adhesion layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51